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Facility Status Notice
The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online.
Equipment Info
- Flip-Chip & Die Bonding
- Wire Bonding
- Optical Alignment & Bonding
- Photonics WB and Facet Attached Optics Fabrication
- Die Shear/ Wire Pull Tester
- Metrology & Visual Inspection
- Plasma Treatment
- Thermal Process
- High Temperature Storage
- Environmental Testing (Thermal)
- Fluid Dispensing
- UV Curing
- Manual Assembly Stations
Recipes + Processes