Ball & Wedge Bonding (F&S 56i Wire Bonder)
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Wire Bonding
| Tool Type | Wire Bonding |
|---|---|
| Location | Softwall Cleanroom |
| Supervisor |
Arin Abed |
| Description | F&S 56i Wire Bonder |
Note: This tool will be available in June 2026.
About
The 56i semi-automatic wire bonding tool is used to create fine-wire electrical interconnections for microelectronic, optoelectronic, and hybrid devices in both Ball-Wedge or Wedge-Wedge configurations. The bonder has modular design with interchangeable heads for different bonding methods as well as wire pull or die shear force measurements.
Application
- Au wire Ball-Wedge bonding.
- Au/Al wire and ribbon deep access wedge-wedge bonding.
- Gold stud bumping.
Bonding Modules (Heads)
Ball-Wedge Bonding and Bumping
Wedge-Wedge, Deep Access, Bonding
System Overview
- XY motor driven table with 100x100mm travel range
- Digital Ultrasonic Generator
- 100x100mm heated workholder
- "Singlewire" bond mode which is ideal for prototyping
- "Multiwire" bond mode for complex assemblies.
- "Step-Mode" which splits the bonding into individual steps.
- Digital Ultrasonic Generator and Controller
Operating Procedure and User's Manual
Wire Types and Application
Available wires at Protofab. Note that this is a dynamic and expanding list.
| Part Number | Description | Application |
|---|---|---|
| GSA-25A100 | 25um(1mil) Diameter, 7.0~14.7 gf BL 1.0~7.0% EL | Au Ball Bonding |
| GLD-H-25A100 | 25um(1mil) Diameter, 16 gf Min BL 3.5% Max EL | Au Wedge Bonding |
| TABN-25A100 | 25um(1mil) Diameter, 13.0~15.0 gf BL 0.5~4.5% EL | Al Wedge Bonding |
Refer to TANAKA CATALOG for additional wire types (supplier: TOPLINE).
Wedge and Ball Bonding Recommended Application
