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Facility Status Notice

The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online.

Equipment Info

• Flip-Chip & Die Bonding
• Wire Bonding
• Optical Alignment & Bonding
• Photonics WB and Facet Attached Optics Fabrication
• Die Shear/ Wire Pull Tester
• Metrology & Visual Inspection
• Plasma Treatment
• Thermal Process
• High Temperature Storage
• Environmental Testing (Thermal)
• Fluid Dispensing
• UV Curing
• Manual Assembly Stations

Recipes + Processes

• Flip-Chip & Die Bonding
• Wire Bonding
• Optical Alignment & Bonding
• Die Shear/Wire Pull Tester
• Plasma Treatment
• Workpiece Fixturing
• Thermal Cure
• Fluid Dispensing
• UV Curing
• General Instructional Documents

Other Links

• Chemicals & MSDS
• FAQ
• Fabrication Services
• Engineering Services
• Staff List
• Directions (Map)
• Protofab Job Postings

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• Nanofab Homepage
• Nanofab Wiki
• UCSB ECE Dept.