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Revision as of 11:48, 2 April 2026 by
Arin2
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Contents
1
Die Attach
1.1
Semi-Automatic Die Attach and Pick n Place
1.2
Manual Die Attach Station
1.3
Thermal Processing
2
Wire Bonding
2.1
Automatic Wire Bonder
2.2
Surface Preparation
3
Optical Interconnects
3.1
Optical Device Alignment and Bonding System
3.2
Photonics Wire Bond and Surface Attached Lens Fabrication
4
Process Verification
4.1
Die Attach and Wire Bond
5
Metrology & Visual Inspection
5.1
Metrology
5.2
Inspection and Assembly Visual Aid
Die Attach
Semi-Automatic Die Attach and Pick n Place
Flip-Chip and Die Bonder (Tresky T-5300-W)
Manual Die Attach Station
Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)
Thermal Processing
Bake Chamber (Yamato DKN Series Forced Convection Ovens)
Wire Bonding
Automatic Wire Bonder
Ball & Wedge Bonding (F&S 56i Wire Bonder)
Surface Preparation
Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)
Optical Interconnects
Optical Device Alignment and Bonding System
Automated alignment and Attach (Fiberpro IFA-600-AUCME3)
Photonics Wire Bond and Surface Attached Lens Fabrication
3D Lithography Based Nano Fabrication (Vanguard Sonata1000)
Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)
Process Verification
Die Attach and Wire Bond
Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)
Metrology & Visual Inspection
Metrology
3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)
Inspection and Assembly Visual Aid
Stereozoom Microscopes