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!Equipment Info
! Equipment Info
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!Recipes + Processes
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!Other Links:</div>
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*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
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*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]]
*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]]
*[[Manual Assembly Station|Manual Assembly Stations]]
*[[Manual Assembly Station|Manual Assembly Stations]]

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! Recipes + Processes
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*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]]
*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]]
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*[[Recipes: Fluid Dispensing|Fluid Dispensing]]
*[[Recipes: Fluid Dispensing|Fluid Dispensing]]
*[[Recipes: UV Curing|UV Curing]]
*[[Recipes: UV Curing|UV Curing]]

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! Other Links
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*[[Chemicals & MSDS]]
*[[Chemicals & MSDS]]
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*[https://wiki.nanofab.ucsb.edu/wiki/Main_Page Nanofab Wiki]
*[https://wiki.nanofab.ucsb.edu/wiki/Main_Page Nanofab Wiki]
*[http://www.ece.ucsb.edu UCSB ECE Dept.]
*[http://www.ece.ucsb.edu UCSB ECE Dept.]
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Revision as of 17:52, 5 May 2026

Welcome to the UCSB Protofab Wiki

Make sure you know the
Protofab Rules


Facility Status Notice

The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online.

Equipment Info
Recipes + Processes
Other Links
Retrieved from "https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&oldid=460"