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Revision as of 13:56, 3 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

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Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Die Shear/ Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Die Shear/Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept.

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 *[[Bake Chamber (Yamato DKN Series Forced Convection Ovens)|Thermal Process]]
 *[[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)|Fluid Dispensing]]
-*[[:Category:UV Curing|UV Curing]]
+*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]]
 |
 *[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]]
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 *[[Recipes: Thermal Process (Bake)|Thermal Process]]
 *[[Recipes: Fluid Dispensing|Fluid Dispensing]]
-*[[UV Curing Recipes|UV Curing]]
+*[[Recipes: UV Curing|UV Curing]]
 |
 *[[Chemicals & MSDS]]