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Revision as of 11:39, 13 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

Make sure you know the
Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Bonding Wire Bonding Photonics WB & Surface Attached Lens Fabrication Die Shear/ Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Die Shear/Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Staff List Directions (Map) Nanofab Homepage UCSB ECE Dept.

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 *[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
 *[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]]
-*[[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)|Optical Alignment & Bonding]]
 *[[Photonics Wire Bond and Surface Attached Lens Fabrication|Photonics WB & Surface Attached Lens Fabrication]]
 *[[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)|Die Shear/ Wire Pull Tester]]
@@ Line 52: / Line 51: @@
 *[[Recipes: Wire Bonding|Wire Bonding]]
 *[[Recipes: Optical Alignment and Attach|Optical Alignment & Bonding]]
-*[[Recipes: PWB 3D Lithography|Photonics WB & Surface Attached Lens Fabrication]]
 *[[Recipes: Die Shear and wire Pull Tester|Die Shear/Wire Pull Tester]]
 *[[Recipes: Application Specific Metrology|Metrology & Visual Inspection]]