Equipment List: Difference between revisions
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===== Thermal Processing ===== |
===== Thermal Processing ===== |
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* Bake Chamber (Yamato DKN Series Forced Convection Ovens) |
* [[Bake Chamber (Yamato DKN Series Forced Convection Ovens)]] |
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== Wire Bonding == |
== Wire Bonding == |
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===== Surface Preparation ===== |
===== Surface Preparation ===== |
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* Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher) |
* [[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)]] |
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== Optical Interconnects == |
== Optical Interconnects == |
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Revision as of 11:03, 2 April 2026
Die Attach
Semi-Automatic Die Attach and Pick n Place
Manual Die Attach Station
- Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
- UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)
Thermal Processing
Wire Bonding
Automatic Wire Bonder
Surface Preparation
Optical Interconnects
Optical Device Alignment and Bonding System
Photonics Wire Bond and Surface Attached Lens Fabrication
- 3D Lithography Based Nano Fabrication (Vanguard Sonata1000)
- Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)
Process Verification
Die Attach and Wire Bond
Metrology & Inspection
Metrology
Inspection
- Visual and Assembly Aid (Leica Stereo zoom Microscope)