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<!-- "WELCOME" BANNER --> |
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<div style="font-size:200%; color:#000; padding-bottom:2px;">Welcome to the UCSB Protofab Wiki</div> |
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<div style="font-size:200%; border:none; color:#000;padding-bottom:2px;">Welcome to the UCSB Protofab Wiki </div> |
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'''[http://signupmonkey.ece.ucsb.edu SignUpMonkey]'''<br /> |
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'''[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/ptools.cgi SignUpMonkey]'''<br /> |
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[[Notes on Reservation]] |
[[Notes on Reservation]] |
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<div style="font-size:105%; border:none; margin:0; padding-left:.1em; color:#000;">'''[https://protowiki3.app.nanofab.ucsb.edu/index.php/Fabrication_Services#Onboarding_for_out-of-town_visitors Get into the Protofab]'''</div> |
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;"> |
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| align="center" style="border-style: solid; border-width: 0px 0px 0px 2px;"| <div style="font-size:105%; border:none; margin:0; padding-left:.1em; color:#000;">'''Make sure you know the <br />[[Protofab Rules|Protofab Rules]]'''</div> |
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'''[https://protowiki3.app.nanofab.ucsb.edu/index.php/Fabrication_Services#Onboarding_for_out-of-town_visitors Get into the Protofab]''' |
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;"> |
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'''Make sure you know the <br />[[Protofab Rules|Protofab Rules]]''' |
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;"> |
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'''[https://protofab.oasis.ucsb.edu Visit Protofab Website]''' |
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[[Category:Templates]] |
[[Category:Templates]] |
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'''Facility Status Notice''' |
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The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online. |
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!Equipment Info |
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!Recipes + Processes |
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'''Engineering Services''' |
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OASIS ProtoFab offers comprehensive, multidisciplinary engineering services to researchers, academic institutions, and industry partners. Our expertise spans mechanical design, electronics, instrumentation, automation, and embedded systems, with support ranging from targeted technical assistance to full-stack engineering development. |
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''More Information:'' [[Engineering Services]] |
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'''Point of contact:''' <br>''Nic Rupert'' <br>[mailto:nrupert@ucsb.edu nrupert@ucsb.edu] |
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Equipment Info</div> |
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*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]] |
*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]] |
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*[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]] |
*[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]] |
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*[[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)|Plasma Treatment]] |
*[[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)|Plasma Treatment]] |
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*[[Bake Chamber (Yamato DKN Series Forced Convection Ovens)|Thermal Process]] |
*[[Bake Chamber (Yamato DKN Series Forced Convection Ovens)|Thermal Process]] |
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*[[High Temperature Storage|High Temperature Vacuum Storage]] |
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*[[Environmental Testing (Thermal)]] |
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*[[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)|Fluid Dispensing]] |
*[[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)|Fluid Dispensing]] |
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*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]] |
*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]] |
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*[[Manual Assembly Station|Manual Assembly Stations]] |
*[[Manual Assembly Station|Manual Assembly Stations]] |
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Recipes + Processes</div> |
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*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]] |
*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]] |
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*[[Recipes: Wire Bonding|Wire Bonding]] |
*[[Recipes: Wire Bonding|Wire Bonding]] |
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*[[Recipes: Optical Alignment and Attach|Optical Alignment & Bonding]] |
*[[Recipes: Optical Alignment and Attach|Optical Alignment & Bonding]] |
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*[[Recipes: Die Shear and wire Pull Tester|Die Shear/Wire Pull Tester]] |
*[[Recipes: Die Shear and wire Pull Tester|Die Shear/Wire Pull Tester]] |
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*[[Recipes: Application Specific Metrology|Metrology & Visual Inspection]] |
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*[[Recipes: Plasma Treatment|Plasma Treatment]] |
*[[Recipes: Plasma Treatment|Plasma Treatment]] |
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*[[Workpiece Fixturing]] |
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*[[Recipes: Thermal Process (Bake)|Thermal Process]] |
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*[[Thermal Cure]] |
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*[[Recipes: Fluid Dispensing|Fluid Dispensing]] |
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*[[Fluid Dispensing]] |
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*[[Recipes: UV Curing|UV Curing]] |
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*[[UV Curing]] |
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*[[General Instructional Documents]] |
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Other Links</div> |
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*[[Chemicals & MSDS]] |
*[[Chemicals & MSDS]] |
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*[[FAQ]] |
*[[FAQ]] |
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*[[Fabrication Services]] |
*[[Fabrication Services]] |
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*[[Engineering Services]] |
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*[[Staff List]] |
*[[Staff List]] |
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*[[Directions (Map)]] |
*[[Directions (Map)]] |
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*[https://wiki.nanofab.ucsb.edu/wiki/Main_Page Nanofab Wiki] |
*[https://wiki.nanofab.ucsb.edu/wiki/Main_Page Nanofab Wiki] |
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*[http://www.ece.ucsb.edu UCSB ECE Dept.] |
*[http://www.ece.ucsb.edu UCSB ECE Dept.] |
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Latest revision as of 11:11, 16 October 2026
Facility Status Notice
The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online.
Engineering Services
OASIS ProtoFab offers comprehensive, multidisciplinary engineering services to researchers, academic institutions, and industry partners. Our expertise spans mechanical design, electronics, instrumentation, automation, and embedded systems, with support ranging from targeted technical assistance to full-stack engineering development.
More Information: Engineering Services
Point of contact:
Nic Rupert
nrupert@ucsb.edu
Equipment Info
- Flip-Chip & Die Bonding
- Wire Bonding
- Optical Alignment & Bonding
- Photonics WB and Facet Attached Optics Fabrication
- Die Shear/ Wire Pull Tester
- Metrology & Visual Inspection
- Plasma Treatment
- Thermal Process
- High Temperature Vacuum Storage
- Environmental Testing (Thermal)
- Fluid Dispensing
- UV Curing
- Manual Assembly Stations
Recipes + Processes