Equipment List

Die Attach

Semi-Automatic Die Attach and Pick n Place

• Flip-Chip and Die Bonder (Tresky T-5300-W)

Manual Die Attach Station

• Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
• UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)

Thermal Processing

• Bake Chamber (Yamato DKN Series Forced Convection Ovens)

Wire Bonding

Automatic Wire Bonder

• Ball & Wedge Bonding (F&S 56i Wire Bonder)

Surface preparation

• Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)

Optical Interconnects

Optical Device Alignment and Bonding System

• Automated alignment and Attach (Fiberpro IFA-600-AUCME3)

Photonics Wire Bond and Surface Attached Lens Fabrication

• 3D Lithography Based Nano Fabrication (Vanguard Sonata1000)
• Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)

Process Verification

Die Attach and Wire Bond

• Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)

Metrology & Inspection

Metrology

• 3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)

Inspection

• Visual and Assembly Aid (Leica Stereo zoom Microscope)