Equipment List: Difference between revisions
Jump to navigation
Jump to search
Content deleted Content added
No edit summary |
|||
| Line 12: | Line 12: | ||
===== Thermal Processing ===== |
===== Thermal Processing ===== |
||
* Bake Chamber (Yamato DKN |
* Bake Chamber (Yamato DKN Series Forced Convection Ovens) |
||
== Wire Bonding == |
== Wire Bonding == |
||
| Line 26: | Line 26: | ||
== Optical Interconnects == |
== Optical Interconnects == |
||
===== |
===== Optical Device Alignment and Bonding System ===== |
||
* Automated alignment and Attach (Fiberpro IFA-600) |
* [[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)]] |
||
===== Photonics Wire Bond and Surface Attached Lens Fabrication ===== |
===== Photonics Wire Bond and Surface Attached Lens Fabrication ===== |
||
* |
* [https://www.vanguard-automation.com/sonata1000/ 3D Lithography Based Nano Fabrication (Vanguard Sonata1000)] |
||
* |
* [https://www.vanguard-automation.com/reprise1000/ Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)] |
||
== Process Verification == |
== Process Verification == |
||
Revision as of 16:49, 1 April 2026
Die Attach
Semi-Automatic Die Attach and Pick n Place
Manual Die Attach Station
- Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
- UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)
Thermal Processing
- Bake Chamber (Yamato DKN Series Forced Convection Ovens)
Wire Bonding
Automatic Wire Bonder
Surface preparation
- Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)
Optical Interconnects
Optical Device Alignment and Bonding System
Photonics Wire Bond and Surface Attached Lens Fabrication
- 3D Lithography Based Nano Fabrication (Vanguard Sonata1000)
- Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)
Process Verification
Die Attach and Wire Bond
Metrology & Inspection
Metrology
Inspection
- Visual and Assembly Aid (Leica Stereo zoom Microscope)