Ball & Wedge Bonding (F&S 56i Wire Bonder)

About

F&S 56i Bonder with Heads

The 56i semi-automatic wire bonding tool is used to create fine-wire electrical interconnections for microelectronic, optoelectronic, and hybrid devices in both Ball-Wedge or Wedge-Wedge configurations. The bonder has modular design with interchangeable heads for different bonding methods as well as wire pull or die shear force measurements.

Application

• Au wire Ball-Wedge bonding.
• Au/Al wire and ribbon deep access wedge-wedge bonding.
• Gold stud bumping.

System Overview

• XY motor driven table with 100x100mm travel range

• Digital Ultrasonic Generator

• 100x100mm heated workholder
• "Singlewire" bond mode which is ideal for prototyping
• "Multiwire" bond mode for complex assemblies.
• "Step-Mode" which splits the bonding into individual steps.
• Digital Ultrasonic Generator and Controller

Operating Procedure and User's Manual

F&S 56i Wire bonder SOP

Recipes

"Under Development"

Knowledge Base

Wire Bonding Basics

Ball-Wedge Bonding by F&S

Wege-Wedge Bonding by F&S

Ribbon Bonding by F&S

Bumping by F&S

Wire Bondability vs Pad Material