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Revision as of 13:15, 3 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

Make sure you know the
Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Attach Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Attach Wire Bonding Optical Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept.

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 *[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Attach]]
-*[[:Category:Wire Bonding|Wire Bonding]]
+*[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]]
 *[[:Category:Optical Alignment & Bonding|Optical Alignment & Bonding]]
 *[[:Category:Photonics WB & Surface Attached Lens Fabrication|Photonics WB & Surface Attached Lens Fabrication]]
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 *[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Attach]]
-*[[Wire Bonding Recipes|Wire Bonding]]
+*[[Recipes: Wire Bonding|Wire Bonding]]
 *[[Optical Alignment & Bonding Recipes|Optical Optical Alignment & Bonding]]
 *[[Photonics WB & Surface Attached Lens Fabrication|Photonics WB & Surface Attached Lens Fabrication]]