View source for Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)

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Plasma Treatment
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<div style="text-align:center; padding:6px;"> [[File:Glen_Tech_R3A_Asher-1.png|none|thumb|The Controller/Generator & Chamber]] </div>
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! style="text-align:left; padding:4px 6px; background:#eee; width:40%;" | Tool Type
| style="padding:4px 6px;" | Plasma Chamber
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! style="text-align:left; padding:4px 6px; background:#eee;" | Location
| style="padding:4px 6px;" | Protofab
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! style="text-align:left; padding:4px 6px; background:#eee;" | Supervisor
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'''Arin Abed'''<br>[mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]
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! style="text-align:left; padding:4px 6px; background:#eee;" | Description
| style="padding:4px 6px;" | Yield Engineering R3A
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<div style="font-weight:bold; margin-bottom:8px;">Tool Actions</div>

<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=96 Sign Up]</div>
<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=96 Get Trained]</div>
<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/report-tool-issue.cgi?tool_ID=96 Report an Issue]</div>
<div style="margin:6px;">[[Recipes: Plasma Treatment|Recipes]]</div>
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== About ==

The Glen Technologies / Yield Engineering Systems (YES) R3A Asher is a low-frequency, batch-process plasma cleaning system designed for precise surface treatment of delicate electro-optical components and assemblies. It has a "downstream" mode for ESD sensitive components.

== Application ==

* Contamination removal from surfaces and pads prior to assembly or wire bonding.

* Surface activation to enhance wetting and improve adhesion. 
* Photoresist stripping which is not the primary use of this equipment in Protofab.

== System Overview ==
The Glen Technologies R3A Asher is a 500W low-frequency system featuring a 14 x 14-inch, two-shelf configuration capable of holding multiple trays or wafers for surface treatment. The system provides three operational modes: Active Plasma for routine cleaning, RIE for aggressive etching, and Downstream for treating ESD-sensitive components, all controlled via a 40kHz Advanced Energy PE-1000 AC source.

== Operating Procedure & User's Manuals ==
[[:File:SOP OAS-PF-0710-00 GlenTech R3A Plasma Chamber.pdf|YES/GlenTech R3A Plasma Chamber SOP]]

== Recipes ==
[[Recipes: Plasma Treatment]]