Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.

If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.

Stocked Chemicals at Protofab

To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.

Chemical (TDS) Type Description Application Vendor
Propanol (SDS) Solvent 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% General Cleaning FISHER SCIENTIFIC
Acetone (SDS) Solvent ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% General Cleaning FISHER SCIENTIFIC
Forming Gas (SDS) Gas 95% Nitrogen, 5% Hydrogen compressed gas mixture Die Attach Airgas
Argon (SDS) Gas Argon compressed gas Plasma Treatment Airgas
GA700H (TDS/SDS) Epoxy Low RI adhesives for Optical Waveguides Optical Coupling NTT-AT
H70E (TDS/SDS) Epoxy Thermally Conductive, Electrically Insulating Epoxy Die Attach EPOTEK
H20E (TDS/SDS) Epoxy Electrically Conductive, Silver filled Die Attach EPOTEK
HYB-353ND (TDS/SDS) Epoxy High temperature dual cure Die attach EPOTEK
OG116-31 (TDS/SDS) Epoxy UV curable encapsulant Encapsulation EPOTEK
3553-LV-UTF_HM (TDS/SDS) Epoxy Mid-RI adhesives for Optical Waveguides Optical Coupling EMIUV
OPTOCAST 3410 (TDS/SDS) Epoxy Low shrinkage low CTE UV and/or heat curable Die attach EMIUV
3145 (TDS/SDS) RTV Adhesive Sealant Strain Relief DOW-Corning
G751 (TDS/SDS) Grease Thermal Interface Material (TIM), non-curable TIM ShinEtsuMicroSi

Knowledge Base

Material

NTT-AT Low RI Material

EPOTEK Selector Guide

EPOTEK Adhesives for PCB Product

EPOTEK Adhesives for Optimized Thermal Management

EPOTEK Low Outgassing Adhesives

EMIUV OPTOCAST Variants

Namics Capillary Underfill Material

Namics Glob Top and Encapsulant Material

Namics Pressure Less Sinter Material

Shin Etsu Material

Rogers Thermally Conductive Preform

Process

UV Spot Cure vs Flood Light

UV Cured Epoxies vs Acrylic System