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Equipment Info Recipes + Processes Other Links: Flip-Chip & Die Attach Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing Flip-Chip & Die Attach Wire Bonding Optical Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept. Facility Rules Equipment List FAQ Chemicals: TDS & SDS