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• 15:08, 26 March 2026 Arin2 talk contribs created page Flip-Chip and Die Bonder (Tresky T-5300-W) (Created page with "== About == Tresky T-5300-W is a die bonder and component placer with motorized and programmable Z-axis, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300-W really shines in applications with highest precision requirements, such as flip-chip or laser diode placement. A high-resolution beam splitter unit allows sub-micron placement accuracy. The T-5300-W features up to a 200mm wafer table whi...") Tag: Visual edit