Chemicals & MSDS: Difference between revisions
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GA700H Docs |
added CHIPSHIELD 2401 to chemicals |
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|Epoxy |
|Epoxy |
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|UV curable encapsulant |
|UV curable encapsulant |
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|Glob Top |
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|Encapsulation |
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|[https://meridianadhesives.com/epoxy-technology/ EPOTEK] |
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK] |
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|CHIPSHIELD 2401 ([[:File:2401 TDS-GlobTop EMIUV.pdf|TDS]]/[[:File:CHIPSHIELD MSDS.pdf|SDS]]) |
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|Epoxy |
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|UV curable encapsulant |
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|Glob Top |
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|[https://emiuv.com/ EMIUV]|- |
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|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf|SDS]]) |
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf|SDS]]) |
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|Epoxy |
|Epoxy |
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Revision as of 11:04, 3 September 2026
Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.
If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.
Stocked Chemicals at Protofab
To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.
| Chemical (TDS) | Type | Description | Application | Vendor | |||||
|---|---|---|---|---|---|---|---|---|---|
| Propanol (SDS) | Solvent | 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% | General Cleaning | FISHER SCIENTIFIC | |||||
| Acetone (SDS) | Solvent | ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% | General Cleaning | FISHER SCIENTIFIC | |||||
| Forming Gas (SDS) | Gas | 95% Nitrogen, 5% Hydrogen compressed gas mixture | Die Attach | Airgas | |||||
| Argon (SDS) | Gas | Argon compressed gas | Plasma Treatment | Airgas | |||||
| GA700H (TDS/SDS) | Epoxy | Low RI adhesives for Optical Waveguides | Optical Coupling | NTT-AT | |||||
| H70E (TDS/SDS) | Epoxy | Thermally Conductive, Electrically Insulating Epoxy | Die Attach | EPOTEK | |||||
| H20E (TDS/SDS) | Epoxy | Electrically Conductive, Silver filled | Die Attach | EPOTEK | |||||
| HYB-353ND (TDS/SDS) | Epoxy | High temperature dual cure | Die attach | EPOTEK | |||||
| OG116-31 (TDS/SDS) | Epoxy | UV curable encapsulant | Glob Top | EPOTEK | |||||
| CHIPSHIELD 2401 (TDS/SDS) | Epoxy | UV curable encapsulant | Glob Top | - | 3553-LV-UTF_HM (TDS/SDS) | Epoxy | Mid-RI adhesives for Optical Waveguides | Optical Coupling | EMIUV |
| OPTOCAST 3410 (TDS/SDS) | Epoxy | Low shrinkage low CTE UV and/or heat curable | Die attach | EMIUV | |||||
| 3145 (TDS/SDS) | RTV | Adhesive Sealant | Strain Relief | DOW-Corning | |||||
| G751 (TDS/SDS) | Grease | Thermal Interface Material (TIM), non-curable | TIM | ShinEtsuMicroSi | |||||
| UNIMEC H9890-6A (TDS/SDS) | Low-temperature Sinter | High thermal conductive paste | Die Attach | NAMICS |
Knowledge Base
Material
EPOTEK Adhesives for PCB Product
EPOTEK Adhesives for Optimized Thermal Management
EPOTEK Low Outgassing Adhesives
Namics Capillary Underfill Material
Namics Glob Top and Encapsulant Material
Namics Pressure Less Sinter Material
Rogers Thermally Conductive Preform