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Revision as of 11:43, 13 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

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Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Die Shear/ Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Die Shear/Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Staff List Directions (Map) Nanofab Homepage UCSB ECE Dept.

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 *[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
 *[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]]
-*[[Optical Alignment & Bonding|Optical Alignment & Bonding]]
+*[[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)|Optical Alignment & Bonding]]
 *[[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)|Die Shear/ Wire Pull Tester]]
 *[[3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)|Metrology & Visual Inspection]]