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Revision as of 13:52, 3 April 2026

Welcome to the UCSB Protofab Wiki

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Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Die Shear/ Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Die Shear/Wire Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept.

@@ Line 45: / Line 45: @@
 *[[3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)|Metrology & Visual Inspection]]
 *[[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)|Plasma Treatment]]
-*[[:Category:Thermal Process|Thermal Process]]
+*[[Bake Chamber (Yamato DKN Series Forced Convection Ovens)|Thermal Process]]
 *[[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)|Fluid Dispensing]]
 *[[:Category:UV Curing|UV Curing]]
@@ Line 56: / Line 56: @@
 *[[Recipes: Application Specific Metrology|Metrology & Visual Inspection]]
 *[[Recipes: Plasma Treatment|Plasma Treatment]]
-*[[Thermal Process Recipes|Thermal Process]]
+*[[Recipes: Thermal Process (Bake)|Thermal Process]]
 *[[Recipes: Fluid Dispensing|Fluid Dispensing]]
 *[[UV Curing Recipes|UV Curing]]