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Revision as of 13:34, 3 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

Make sure you know the
Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Bonding Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept.

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-*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Attach]]
+*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
 *[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]]
 *[[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)|Optical Alignment & Bonding]]
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 *[[:Category:UV Curing|UV Curing]]
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-*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Attach]]
+*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]]
 *[[Recipes: Wire Bonding|Wire Bonding]]
 *[[Recipes: Optical Alignment and Attach|Optical Alignment & Bonding]]