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Revision as of 13:08, 3 April 2026

Welcome to the UCSB Protofab Wiki

Get into the Protofab

Make sure you know the
Protofab Rules

Equipment Info	Recipes + Processes	Other Links:
Flip-Chip & Die Attach Wire Bonding Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Flip-Chip & Die Attach Wire Bonding Optical Optical Alignment & Bonding Photonics WB & Surface Attached Lens Fabrication Shear/Pull Tester Metrology & Visual Inspection Plasma Treatment Thermal Process Fluid Dispensing UV Curing	Chemicals & MSDS FAQ Fabrication Services Directions (Map) Nanofab Homepage UCSB ECE Dept.

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-*[[:Category:Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Attach]]
+*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Attach]]
 *[[:Category:Wire Bonding|Wire Bonding]]
 *[[:Category:Optical Alignment & Bonding|Optical Alignment & Bonding]]