Chemicals & MSDS: Difference between revisions
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|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
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|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
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|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|[https://www.airgas.com/ Airgas]
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
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|Argon compressed gas
|Plasma Treatment
|[https://www.airgas.com/ Airgas]
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
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|Low RI adhesives for Optical Waveguides
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
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|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
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|Electrically Conductive, Silver filled
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
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|high temperature dual cure
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
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|UV curable encapsulant
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
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|mid-RI adhesives for Optical Waveguides
|Optical Coupling
|[https://emiuv.com/ EMIUV]
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS)
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|Low shrinkage low CTE UV and/or heat curable
|Die attach
|[https://emiuv.com/ EMIUV]
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
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|Adhesive Sealant
|Strain Relief
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
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|Thermal Interface Material (TIM), non-curable
|TIM
|[https://www.microsi.com/ ShinEtsuMicroSi]
|}
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