Equipment List: Difference between revisions
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== Die Attach == |
== Die Attach == |
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===== Semi |
===== Semi-Automatic Die Attach and Pick n Place ===== |
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* [[Flip-Chip and Die Bonder (Tresky T-5300-W)]] |
* [[Flip-Chip and Die Bonder (Tresky T-5300-W)]] |
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===== Die Attach and Wire Bond ===== |
===== Die Attach and Wire Bond ===== |
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* Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester) |
* [[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)]] |
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== Metrology & Inspection == |
== Metrology & Inspection == |
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Revision as of 12:05, 30 March 2026
Die Attach
Semi-Automatic Die Attach and Pick n Place
Manual Die Attach Station
- Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
- UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)
Thermal Processing
- Bake Chamber (Yamato DKN 402 Forced Convection Oven)
Wire Bonding
Automatic Wire Bonder
Surface preparation
- Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)
Optical Interconnects
Fiber based and Free Space Optical Alignment and Attach
- Automated alignment and Attach (Fiberpro IFA-600)
Photonics Wire Bond and Surface Attached Lens Fabrication
- 3D Lithography Based Nano Fabrication (Vanguard Sonata1000)
- Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)
Process Verification
Die Attach and Wire Bond
Metrology & Inspection
Metrology
- 3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)
Inspection
- Visual and Assembly Aid (Leica Stereo zoom Microscope)