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Equipment List: Difference between revisions
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Revision as of 14:30, 26 March 2026
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Revision as of 14:40, 26 March 2026
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Automatic/Semi Die Attach and Pick n Place
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== Die Attach ==
=====
Automatic/
Semi
Automatic
Die Attach and Pick n Place =====
* Flip-Chip and Die Bonder (Tresky T-5300-W)