Thermal Cure: Difference between revisions
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|1500mW/cm2 for 30 sec |
|1500mW/cm2 for 30 sec |
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|UNIMEC H9890-6A |
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|Ramp up 60 min. to 175°C + 90 min. hold @ 175°C |
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* Curing UNIMEC H9890-6A at lower temperatures may result in lower thermal conductivity |
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Revision as of 13:03, 11 September 2026
Bake Recipes
The following are recommended cure times and temperatures based on manufacturer's technical data sheet information. For hybrid materials, do UV initial tack before thermal bake for full crosslink.
| Material | Recommended Cure (Temp°C/Time) | Alternate 1 | Alternate 2 | Alternate 3 | Initial Tack |
|---|---|---|---|---|---|
| HYB-353ND | 100°C/30 min | 150°C/30 min | 80°C/ 1 hour | 100mW/cm2 for 1min | |
| H70E | 150°C/1 hour | 120°C/30min | 100°C/1 hour | ||
| H20E | 150°C/1 hour | 80°C/3 hours | |||
| GA700H | 100°C/1 hour | 150mW/cm2 for 2 min | |||
| 3553-LV-UTF_HM | 110°C/1 hour | 1000mW/cm2 for 30 sec | |||
| CHIPSHIELD 2401 | 110°C/1 hour | 1000mW/cm2 for 30 sec | |||
| OPTOCAST 3410 | 110°C/1 hour | 1500mW/cm2 for 30 sec | |||
| UNIMEC H9890-6A | Ramp up 60 min. to 175°C + 90 min. hold @ 175°C |
- Curing UNIMEC H9890-6A at lower temperatures may result in lower thermal conductivity