Equipment List: Difference between revisions
Jump to navigation
Jump to search
Content deleted Content added
No edit summary |
No edit summary |
||
| Line 32: | Line 32: | ||
===== Photonics Wire Bond and Surface Attached Lens Fabrication ===== |
===== Photonics Wire Bond and Surface Attached Lens Fabrication ===== |
||
* [ |
* [[3D Lithography Based Nano Fabrication (Vanguard Sonata1000)|3D Lithography Based Nano Fabrication]] |
||
* [ |
* [./Https://www.vanguard-automation.com/reprise1000/ Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)] |
||
== Process Verification == |
== Process Verification == |
||
Revision as of 13:28, 3 April 2026
Die Attach
Semi-Automatic Die Attach and Pick n Place
Manual Die Attach Station
- Precision Fluid Dispensing (Nordson EFD Ultimus I/II)
- UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)
Thermal Processing
Wire Bonding
Automatic Wire Bonder
Surface Preparation
Optical Interconnects
Optical Device Alignment and Bonding System
Photonics Wire Bond and Surface Attached Lens Fabrication
- 3D Lithography Based Nano Fabrication
- [./Https://www.vanguard-automation.com/reprise1000/ Automated Pre/post Development and Encapsulation (Vanguard Reprise1000)]