Chemicals & MSDS: Difference between revisions

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|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
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|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
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|95% Nitrogen, 5% Hydrogen compressed gas mixture
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|Die Attach
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
|Argon ([[:File:Argon MSDS.pdf|SDS]])
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|Argon compressed gas
|Argon compressed gas
|Plasma Treatment
|Plasma Treatment
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
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|Low RI adhesives for Optical Waveguides
|Low RI adhesives for Optical Waveguides
|Optical Coupling
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|NTT-AT
|-
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
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|Thermally Conductive, Electrically Insulating Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
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|Electrically Conductive, Silver filled
|Electrically Conductive, Silver filled
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
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|high temperature dual cure
|high temperature dual cure
|Die attach
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
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|UV curable encapsulant
|UV curable encapsulant
|Encapsulation
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
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|mid-RI adhesives for Optical Waveguides
|mid-RI adhesives for Optical Waveguides
|Optical Coupling
|Optical Coupling
|EMIUV
|[https://emiuv.com/ EMIUV]
|-
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS)
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS)
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|Low shrinkage low CTE UV and/or heat curable
|Low shrinkage low CTE UV and/or heat curable
|Die attach
|Die attach
|EMIUV
|[https://emiuv.com/ EMIUV]
|-
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
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|Adhesive Sealant
|Adhesive Sealant
|Strain Relief
|Strain Relief
|DOW-Corning
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
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|Thermal Interface Material (TIM), non-curable
|Thermal Interface Material (TIM), non-curable
|TIM
|TIM
|ShinEtsuMicroSi
|[https://www.microsi.com/ ShinEtsuMicroSi]
|}
|}

Revision as of 13:47, 31 March 2026

Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.

If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.

Stocked Chemicals at Protofab

To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.

Chemical (TDS) Type Description Application Vendor
Propanol (SDS) Solvent 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% General Cleaning FISHER SCIENTIFIC
Acetone (SDS) Solvent ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% General Cleaning FISHER SCIENTIFIC
Forming Gas (SDS) Gas 95% Nitrogen, 5% Hydrogen compressed gas mixture Die Attach Airgas
Argon (SDS) Gas Argon compressed gas Plasma Treatment Airgas
GA700H (TDS/SDS) Epoxy Low RI adhesives for Optical Waveguides Optical Coupling NTT-AT
H70E (TDS/SDS) Epoxy Thermally Conductive, Electrically Insulating Epoxy Die Attach EPOTEK
H20E (TDS/SDS) Epoxy Electrically Conductive, Silver filled Die Attach EPOTEK
HYB-353ND (TDS/SDS) Epoxy high temperature dual cure Die attach EPOTEK
OG116-31 (TDS/SDS) Epoxy UV curable encapsulant Encapsulation EPOTEK
3553-LV-UTF_HM (TDS/SDS) Epoxy mid-RI adhesives for Optical Waveguides Optical Coupling EMIUV
OPTOCAST 3410 (TDS/SDS) Epoxy Low shrinkage low CTE UV and/or heat curable Die attach EMIUV
3145 (TDS/SDS) RTV Adhesive Sealant Strain Relief DOW-Corning
G751 (TDS/SDS) Grease Thermal Interface Material (TIM), non-curable TIM ShinEtsuMicroSi
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