Chemicals & MSDS: Difference between revisions
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|NTT-AT |
|NTT-AT |
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|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/SDS) |
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]]) |
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|Epoxy |
|Epoxy |
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|Thermally Conductive, Electrically Insulating Epoxy |
|Thermally Conductive, Electrically Insulating Epoxy |
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|EPOTEK |
|EPOTEK |
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|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/SDS) |
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]]) |
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|Epoxy |
|Epoxy |
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|Electrically Conductive, Silver filled |
|Electrically Conductive, Silver filled |
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|EPOTEK |
|EPOTEK |
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|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/SDS) |
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]]) |
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|Epoxy |
|Epoxy |
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|high temperature dual cure |
|high temperature dual cure |
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|EPOTEK |
|EPOTEK |
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|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/SDS) |
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]]) |
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|Epoxy |
|Epoxy |
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|UV curable encapsulant |
|UV curable encapsulant |
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Revision as of 13:28, 31 March 2026
Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.
If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.
Stocked Chemicals at Protofab
To view Material Technical or safety Data Sheet, click on "TDS" or SDS respectively.
| Chemical (TDS) | Type | Description | Application | Vendor |
|---|---|---|---|---|
| Propanol (SDS) | Solvent | 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% | General Cleaning | FISHER SCIENTIFIC |
| Acetone (SDS) | Solvent | ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% | General Cleaning | FISHER SCIENTIFIC |
| Forming Gas (SDS) | Gas | 95% Nitrogen, 5% Hydrogen compressed gas mixture | Die Attach | Airgas |
| Argon (SDS) | Gas | Argon compressed gas | Plasma Treatment | Airgas |
| GA700H (TDS/SDS) | Epoxy | Low RI adhesives for Optical Waveguides | Optical Coupling | NTT-AT |
| H70E (TDS/SDS) | Epoxy | Thermally Conductive, Electrically Insulating Epoxy | Die Attach | EPOTEK |
| H20E (TDS/SDS) | Epoxy | Electrically Conductive, Silver filled | Die Attach | EPOTEK |
| HYB-353ND (TDS/SDS) | Epoxy | high temperature dual cure | Die attach | EPOTEK |
| OG116-31 (TDS/SDS) | Epoxy | UV curable encapsulant | Encapsulation | EPOTEK |
| 3553-LV-UTF_HM (TDS/SDS) | Epoxy | mid-RI adhesives for Optical Waveguides | Optical Coupling | EMIUV |
| OPTOCAST 3410 (TDS/SDS) | Epoxy | Low shrinkage low CTE UV and/or heat curable | Die attach | EMIUV |
| 3145 (TDS/SDS) | RTV | Adhesive Sealant | Strain Relief | DOW-Corning |
| G751 (TDS/SDS) | Grease | Thermal Interface Material (TIM), non-curable | TIM | ShinEtsuMicroSi |