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<!-- "WELCOME" BANNER -->
=== [[Facility Rules]] ===
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<div style="font-size:200%; color:#000; padding-bottom:2px;">Welcome to the UCSB Protofab Wiki</div>
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<!-- QUICK LINKS BANNER -->
=== [[SOPs]] ===
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'''[http://signupmonkey.ece.ucsb.edu SignUpMonkey]'''<br />
[[Notes on Reservation]]
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;">
'''[https://protowiki3.app.nanofab.ucsb.edu/index.php/Fabrication_Services#Onboarding_for_out-of-town_visitors Get into the Protofab]'''
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;">
'''Make sure you know the <br />[[Protofab Rules|Protofab Rules]]'''
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<div style="flex:1 1 auto; min-width:50px; max-width:320px; text-align:center; padding:10px; font-size:105%; color:#000;">
'''[https://protofab.oasis.ucsb.edu Visit Protofab Website]'''
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<noinclude>
[[Category:Templates]]
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<!-- FACILITY STATUS NOTICE -->
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'''Facility Status Notice'''
 
The Protofab facility is currently under development. Equipment listed or advertised on this page may be in the process of procurement, delivery, installation, qualification, or user-readiness review. Availability is subject to change as the facility continues to come online.
 
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<!-- MAIN CONTENT CARDS -->
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Equipment Info</div>
 
*[[Flip-Chip and Die Bonder (Tresky T-5300-W)|Flip-Chip & Die Bonding]]
*[[Ball & Wedge Bonding (F&S 56i Wire Bonder)|Wire Bonding]]
*[[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)|Optical Alignment & Bonding]]
*[[Photonics WB and Facet Attached Optics Fabrication]]
*[[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)|Die Shear/ Wire Pull Tester]]
*[[3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)|Metrology & Visual Inspection]]
*[[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)|Plasma Treatment]]
*[[Bake Chamber (Yamato DKN Series Forced Convection Ovens)|Thermal Process]]
*[[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)|Fluid Dispensing]]
*[[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)|UV Curing]]
*[[Manual Assembly Station|Manual Assembly Stations]]
 
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Recipes + Processes</div>
 
*[[Recipes: Flip-Chip and Die Bonding|Flip-Chip & Die Bonding]]
*[[Recipes: Wire Bonding|Wire Bonding]]
*[[Recipes: Optical Alignment and Attach|Optical Alignment & Bonding]]
*[[Recipes: Die Shear and wire Pull Tester|Die Shear/Wire Pull Tester]]
*[[Recipes: Application Specific Metrology|Metrology & Visual Inspection]]
*[[Recipes: Plasma Treatment|Plasma Treatment]]
*[[Recipes: Thermal Process (Bake)|Thermal Process]]
*[[Recipes: Fluid Dispensing|Fluid Dispensing]]
*[[Recipes: UV Curing|UV Curing]]
 
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<div style="font-weight:bold; font-size:108%; border-bottom:1px solid #a2a9b1; padding-bottom:6px; margin-bottom:8px;">Other Links</div>
 
*[[Chemicals & MSDS]]
*[[FAQ]]
*[[Fabrication Services]]
*[[Staff List]]
*[[Directions (Map)]]
*[[Protofab Job Postings]]
<hr />
*[http://nanofab.ucsb.edu Nanofab Homepage]
*[https://wiki.nanofab.ucsb.edu/wiki/Main_Page Nanofab Wiki]
*[http://www.ece.ucsb.edu UCSB ECE Dept.]
 
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