Chemicals & MSDS: Difference between revisions
Jump to navigation
Jump to search
Content deleted Content added
mNo edit summary |
Fixed table arrangement |
||
| (5 intermediate revisions by one other user not shown) | |||
| Line 37: | Line 37: | ||
|[https://www.airgas.com/ Airgas] |
|[https://www.airgas.com/ Airgas] |
||
|- |
|- |
||
|GA700H ([[:File: |
|GA700H ([[:File:NTT-AT GA700H TDS.pdf|TDS]]/[[:File:NTT-AT GA700H MSDS.pdf|SDS]]) |
||
|Epoxy |
|Epoxy |
||
|Low RI adhesives for Optical Waveguides |
|Low RI adhesives for Optical Waveguides |
||
|Optical Coupling |
|Optical Coupling |
||
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT] |
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT] |
||
|- |
|||
|3553-LVUTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf|SDS]]) |
|||
|Epoxy |
|||
| ⚫ | |||
| ⚫ | |||
|[https://emiuv.com/ EMIUV] |
|||
|- |
|- |
||
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]]) |
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]]) |
||
| Line 64: | Line 70: | ||
|Epoxy |
|Epoxy |
||
|UV curable encapsulant |
|UV curable encapsulant |
||
|Glob Top |
|||
|Encapsulation |
|||
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK] |
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK] |
||
|- |
|- |
||
| |
|CHIPSHIELD 2401 ([[:File:2401 TDS-GlobTop EMIUV.pdf|TDS]]/[[:File:CHIPSHIELD MSDS.pdf|SDS]]) |
||
|Epoxy |
|Epoxy |
||
|UV curable encapsulant |
|||
| ⚫ | |||
|Glob Top |
|||
| ⚫ | |||
|[https://emiuv.com/ EMIUV] |
|[https://emiuv.com/ EMIUV]|- |
||
|- |
|- |
||
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS) |
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3410 EMIUV MSDS.pdf|SDS]]) |
||
|Epoxy |
|Epoxy |
||
|Low shrinkage low CTE UV and/or heat curable |
|Low shrinkage low CTE UV and/or heat curable |
||
| Line 90: | Line 96: | ||
|TIM |
|TIM |
||
|[https://www.microsi.com/ ShinEtsuMicroSi] |
|[https://www.microsi.com/ ShinEtsuMicroSi] |
||
|- |
|||
|UNIMEC H9890-6A ([[:File:NAMICS UNIMEC H9890-6A.pdf|TDS]]/[[:File:H9890-6A MSDS.pdf|SDS]]) |
|||
|Low-temperature Sinter |
|||
|High thermal conductive paste |
|||
|Die Attach |
|||
|[https://namics-corp.com/low-temperature-pressure-less-sintering/#contact NAMICS] |
|||
|} |
|} |
||
| Line 99: | Line 111: | ||
[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]] |
[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]] |
||
[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf|EPOTEK Adhesives for PCB Product]] |
[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]] |
||
[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]] |
[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]] |
||
Latest revision as of 08:33, 4 September 2026
Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.
If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.
Stocked Chemicals at Protofab
To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.
| Chemical (TDS) | Type | Description | Application | Vendor |
|---|---|---|---|---|
| Propanol (SDS) | Solvent | 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% | General Cleaning | FISHER SCIENTIFIC |
| Acetone (SDS) | Solvent | ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% | General Cleaning | FISHER SCIENTIFIC |
| Forming Gas (SDS) | Gas | 95% Nitrogen, 5% Hydrogen compressed gas mixture | Die Attach | Airgas |
| Argon (SDS) | Gas | Argon compressed gas | Plasma Treatment | Airgas |
| GA700H (TDS/SDS) | Epoxy | Low RI adhesives for Optical Waveguides | Optical Coupling | NTT-AT |
| 3553-LVUTF_HM (TDS/SDS) | Epoxy | Mid-RI Adhesives for Optical Waveguides | Optical Coupling | EMIUV |
| H70E (TDS/SDS) | Epoxy | Thermally Conductive, Electrically Insulating Epoxy | Die Attach | EPOTEK |
| H20E (TDS/SDS) | Epoxy | Electrically Conductive, Silver filled | Die Attach | EPOTEK |
| HYB-353ND (TDS/SDS) | Epoxy | High temperature dual cure | Die attach | EPOTEK |
| OG116-31 (TDS/SDS) | Epoxy | UV curable encapsulant | Glob Top | EPOTEK |
| CHIPSHIELD 2401 (TDS/SDS) | Epoxy | UV curable encapsulant | Glob Top | - |
| OPTOCAST 3410 (TDS/SDS) | Epoxy | Low shrinkage low CTE UV and/or heat curable | Die attach | EMIUV |
| 3145 (TDS/SDS) | RTV | Adhesive Sealant | Strain Relief | DOW-Corning |
| G751 (TDS/SDS) | Grease | Thermal Interface Material (TIM), non-curable | TIM | ShinEtsuMicroSi |
| UNIMEC H9890-6A (TDS/SDS) | Low-temperature Sinter | High thermal conductive paste | Die Attach | NAMICS |
Knowledge Base
Material
EPOTEK Adhesives for PCB Product
EPOTEK Adhesives for Optimized Thermal Management
EPOTEK Low Outgassing Adhesives
Namics Capillary Underfill Material
Namics Glob Top and Encapsulant Material
Namics Pressure Less Sinter Material
Rogers Thermally Conductive Preform