Chemicals & MSDS: Difference between revisions
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|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|Epoxy
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|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
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|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|Epoxy
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|Optical Coupling
|[https://emiuv.com/ EMIUV]
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|[https://www.microsi.com/ ShinEtsuMicroSi]
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== Knowledge Base ==
===== Material =====
[[:File:Low RI Epoxy NTT-AT.pdf|NTT-AT Low RI Material]]
[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]]
[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]]
[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]]
[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf|EPOTEK Low Outgassing Adhesives]]
[[:File:OPTOCAST Variant EMIUV-compressed.pdf|EMIUV OPTOCAST Variants]]
[[:File:Capilary-Underfill Namics.pdf|Namics Capillary Underfill Material]]
[[:File:Glob-Top-Encapsulant-Materials Namics.pdf|Namics Glob Top and Encapsulant Material]]
[[:File:Pressure-less-Sintering NAMICS.pdf|Namics Pressure Less Sinter Material]]
[[:File:Sensors-line-card-final.pdf|Shin Etsu Material]]
[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf|Rogers Thermally Conductive Preform]]
===== Process =====
[[:File:UV Spot Cure vs Flood Light.pdf|UV Spot Cure vs Flood Light]]
[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf|UV Cured Epoxies vs Acrylic System]]
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