Chemicals & MSDS: Difference between revisions

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|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
Line 23: Line 23:
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
Line 29: Line 29:
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|Die Attach
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
|Argon ([[:File:Argon MSDS.pdf|SDS]])
Line 35: Line 35:
|Argon compressed gas
|Argon compressed gas
|Plasma Treatment
|Plasma Treatment
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
|GA700H ([[:File:NTT-AT GA700H TDS.pdf|TDS]]/[[:File:NTT-AT GA700H MSDS.pdf|SDS]])
|Epoxy
|Epoxy
|Low RI adhesives for Optical Waveguides
|Low RI adhesives for Optical Waveguides
|Optical Coupling
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|NTT-AT
|-
|3553-LVUTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf|SDS]])
|Epoxy
⚫
|Mid-RI Adhesives for Optical Waveguides
⚫
|Optical Coupling
|[https://emiuv.com/ EMIUV]
|-
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
Line 47: Line 53:
|Thermally Conductive, Electrically Insulating Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
Line 53: Line 59:
|Electrically Conductive, Silver filled
|Electrically Conductive, Silver filled
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|Epoxy
|Epoxy
|high temperature dual cure
|High temperature dual cure
|Die attach
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|Epoxy
|Epoxy
|UV curable encapsulant
|UV curable encapsulant
|Glob Top
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|CHIPSHIELD 2401 ([[:File:2401 TDS-GlobTop EMIUV.pdf|TDS]]/[[:File:CHIPSHIELD MSDS.pdf|SDS]])
|Epoxy
|Epoxy
|UV curable encapsulant
⚫
|mid-RI adhesives for Optical Waveguides
|Glob Top
⚫
|Optical Coupling
|EMIUV
|[https://emiuv.com/ EMIUV]|-
|-
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS)
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/[[:File:OPTOCAST 3410 EMIUV MSDS.pdf|SDS]])
|Epoxy
|Epoxy
|Low shrinkage low CTE UV and/or heat curable
|Low shrinkage low CTE UV and/or heat curable
|Die attach
|Die attach
|EMIUV
|[https://emiuv.com/ EMIUV]
|-
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
Line 83: Line 89:
|Adhesive Sealant
|Adhesive Sealant
|Strain Relief
|Strain Relief
|DOW-Corning
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
Line 89: Line 95:
|Thermal Interface Material (TIM), non-curable
|Thermal Interface Material (TIM), non-curable
|TIM
|TIM
|ShinEtsuMicroSi
|[https://www.microsi.com/ ShinEtsuMicroSi]
|-
|UNIMEC H9890-6A ([[:File:NAMICS UNIMEC H9890-6A.pdf|TDS]]/[[:File:H9890-6A MSDS.pdf|SDS]])
|Low-temperature Sinter
|High thermal conductive paste
|Die Attach
|[https://namics-corp.com/low-temperature-pressure-less-sintering/#contact NAMICS]
|}
|}

== Knowledge Base ==

===== Material =====
[[:File:Low RI Epoxy NTT-AT.pdf|NTT-AT Low RI Material]]

[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]]

[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]]

[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]]

[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf|EPOTEK Low Outgassing Adhesives]]

[[:File:OPTOCAST Variant EMIUV-compressed.pdf|EMIUV OPTOCAST Variants]]

[[:File:Capilary-Underfill Namics.pdf|Namics Capillary Underfill Material]]

[[:File:Glob-Top-Encapsulant-Materials Namics.pdf|Namics Glob Top and Encapsulant Material]]

[[:File:Pressure-less-Sintering NAMICS.pdf|Namics Pressure Less Sinter Material]]

[[:File:Sensors-line-card-final.pdf|Shin Etsu Material]]

[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf|Rogers Thermally Conductive Preform]]

===== Process =====
[[:File:UV Spot Cure vs Flood Light.pdf|UV Spot Cure vs Flood Light]]

[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf|UV Cured Epoxies vs Acrylic System]]

Latest revision as of 08:33, 4 September 2026

Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.

If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.

Stocked Chemicals at Protofab

To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.

Chemical (TDS) Type Description Application Vendor
Propanol (SDS) Solvent 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% General Cleaning FISHER SCIENTIFIC
Acetone (SDS) Solvent ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% General Cleaning FISHER SCIENTIFIC
Forming Gas (SDS) Gas 95% Nitrogen, 5% Hydrogen compressed gas mixture Die Attach Airgas
Argon (SDS) Gas Argon compressed gas Plasma Treatment Airgas
GA700H (TDS/SDS) Epoxy Low RI adhesives for Optical Waveguides Optical Coupling NTT-AT
3553-LVUTF_HM (TDS/SDS) Epoxy Mid-RI Adhesives for Optical Waveguides Optical Coupling EMIUV
H70E (TDS/SDS) Epoxy Thermally Conductive, Electrically Insulating Epoxy Die Attach EPOTEK
H20E (TDS/SDS) Epoxy Electrically Conductive, Silver filled Die Attach EPOTEK
HYB-353ND (TDS/SDS) Epoxy High temperature dual cure Die attach EPOTEK
OG116-31 (TDS/SDS) Epoxy UV curable encapsulant Glob Top EPOTEK
CHIPSHIELD 2401 (TDS/SDS) Epoxy UV curable encapsulant Glob Top -
OPTOCAST 3410 (TDS/SDS) Epoxy Low shrinkage low CTE UV and/or heat curable Die attach EMIUV
3145 (TDS/SDS) RTV Adhesive Sealant Strain Relief DOW-Corning
G751 (TDS/SDS) Grease Thermal Interface Material (TIM), non-curable TIM ShinEtsuMicroSi
UNIMEC H9890-6A (TDS/SDS) Low-temperature Sinter High thermal conductive paste Die Attach NAMICS

Knowledge Base

Material

NTT-AT Low RI Material

EPOTEK Selector Guide

EPOTEK Adhesives for PCB Product

EPOTEK Adhesives for Optimized Thermal Management

EPOTEK Low Outgassing Adhesives

EMIUV OPTOCAST Variants

Namics Capillary Underfill Material

Namics Glob Top and Encapsulant Material

Namics Pressure Less Sinter Material

Shin Etsu Material

Rogers Thermally Conductive Preform

Process

UV Spot Cure vs Flood Light

UV Cured Epoxies vs Acrylic System

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