Chemicals & MSDS: Difference between revisions
Content deleted Content added
mNo edit summary |
mNo edit summary |
||
| (9 intermediate revisions by the same user not shown) | |||
Line 4:
=== Stocked Chemicals at Protofab ===
To view Material Technical or safety Data Sheet, click on "'''TDS" or "SDS" respectively'''.
{| class="wikitable sortable mw-collapsible"
|+
Line 17:
|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
Line 23:
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
Line 29:
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|[https://www.airgas.com/ Airgas]
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
Line 35:
|Argon compressed gas
|Plasma Treatment
|[https://www.airgas.com/ Airgas]
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
Line 41:
|Low RI adhesives for Optical Waveguides
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Electrically Conductive, Silver filled
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|Epoxy
|
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|Epoxy
|UV curable encapsulant
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|Epoxy
|
|Optical Coupling
|[https://emiuv.com/ EMIUV]
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS
|Epoxy
|Low shrinkage low CTE UV and/or heat curable
|Die attach
|[https://emiuv.com/ EMIUV]
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
Line 83:
|Adhesive Sealant
|Strain Relief
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
Line 89:
|Thermal Interface Material (TIM), non-curable
|TIM
|[https://www.microsi.com/ ShinEtsuMicroSi]
|}
== Knowledge Base ==
===== Material =====
[[:File:Low RI Epoxy NTT-AT.pdf|NTT-AT Low RI Material]]
[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]]
[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]]
[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]]
[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf|EPOTEK Low Outgassing Adhesives]]
[[:File:OPTOCAST Variant EMIUV-compressed.pdf|EMIUV OPTOCAST Variants]]
[[:File:Capilary-Underfill Namics.pdf|Namics Capillary Underfill Material]]
[[:File:Glob-Top-Encapsulant-Materials Namics.pdf|Namics Glob Top and Encapsulant Material]]
[[:File:Pressure-less-Sintering NAMICS.pdf|Namics Pressure Less Sinter Material]]
[[:File:Sensors-line-card-final.pdf|Shin Etsu Material]]
[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf|Rogers Thermally Conductive Preform]]
===== Process =====
[[:File:UV Spot Cure vs Flood Light.pdf|UV Spot Cure vs Flood Light]]
[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf|UV Cured Epoxies vs Acrylic System]]
| |||