Chemicals & MSDS: Difference between revisions
Content deleted Content added
Created page with "'''Facility Users are responsible for understanding the dangers and safety of the chemicals they use!''' You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to. If you would like to know if you can bring a new chemical into the cleanroom, please contact the [mailto:arin_abed@ucsb.edu Facility Manager]. === Stocked Chemicals at Protofab === To view Material Technical or safety Data Sheet, click on "'''TDS" or SDS respective..." |
mNo edit summary |
||
| (10 intermediate revisions by the same user not shown) | |||
Line 4:
=== Stocked Chemicals at Protofab ===
To view Material Technical or safety Data Sheet, click on "'''TDS" or "SDS" respectively'''.
{| class="wikitable sortable mw-collapsible"
|+
Line 17:
|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
Line 23:
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
Line 29:
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|[https://www.airgas.com/ Airgas]
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
Line 35:
|Argon compressed gas
|Plasma Treatment
|[https://www.airgas.com/ Airgas]
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
Line 41:
|Low RI adhesives for Optical Waveguides
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Electrically Conductive, Silver filled
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|Epoxy
|
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|Epoxy
|UV curable encapsulant
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|Epoxy
|
|Optical Coupling
|[https://emiuv.com/ EMIUV]
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS
|Epoxy
|Low shrinkage low CTE UV and/or heat curable
|Die attach
|[https://emiuv.com/ EMIUV]
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
|RTV
|Adhesive Sealant
|Strain Relief
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
|Grease
|Thermal Interface Material (TIM), non-curable
|TIM
|[https://www.microsi.com/ ShinEtsuMicroSi]
|}
== Knowledge Base ==
===== Material =====
[[:File:Low RI Epoxy NTT-AT.pdf|NTT-AT Low RI Material]]
[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]]
[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]]
[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]]
[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf|EPOTEK Low Outgassing Adhesives]]
[[:File:OPTOCAST Variant EMIUV-compressed.pdf|EMIUV OPTOCAST Variants]]
[[:File:Capilary-Underfill Namics.pdf|Namics Capillary Underfill Material]]
[[:File:Glob-Top-Encapsulant-Materials Namics.pdf|Namics Glob Top and Encapsulant Material]]
[[:File:Pressure-less-Sintering NAMICS.pdf|Namics Pressure Less Sinter Material]]
[[:File:Sensors-line-card-final.pdf|Shin Etsu Material]]
[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf|Rogers Thermally Conductive Preform]]
===== Process =====
[[:File:UV Spot Cure vs Flood Light.pdf|UV Spot Cure vs Flood Light]]
[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf|UV Cured Epoxies vs Acrylic System]]
| |||