Chemicals & MSDS: Difference between revisions

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Created page with "'''Facility Users are responsible for understanding the dangers and safety of the chemicals they use!''' You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to. If you would like to know if you can bring a new chemical into the cleanroom, please contact the [mailto:arin_abed@ucsb.edu Facility Manager]. === Stocked Chemicals at Protofab === To view Material Technical or safety Data Sheet, click on "'''TDS" or SDS respective..."
 
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=== Stocked Chemicals at Protofab ===
=== Stocked Chemicals at Protofab ===
To view Material Technical or safety Data Sheet, click on "'''TDS" or SDS respectively'''.
To view Material Technical or safety Data Sheet, click on "'''TDS" or "SDS" respectively'''.
{| class="wikitable sortable mw-collapsible"
{| class="wikitable sortable mw-collapsible"
|+
|+
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|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
|Acetone ([[:File:ACETONE - High Purity - SDS .pdf|SDS]])
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|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
|General Cleaning
|General Cleaning
|FISHER SCIENTIFIC
|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
|-
|-
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
|Forming Gas ([[:File:Forming Gas-MSDS.pdf|SDS]])
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|95% Nitrogen, 5% Hydrogen compressed gas mixture
|95% Nitrogen, 5% Hydrogen compressed gas mixture
|Die Attach
|Die Attach
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|Argon ([[:File:Argon MSDS.pdf|SDS]])
|Argon ([[:File:Argon MSDS.pdf|SDS]])
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|Argon compressed gas
|Argon compressed gas
|Plasma Treatment
|Plasma Treatment
|Airgas
|[https://www.airgas.com/ Airgas]
|-
|-
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf|TDS]]/SDS)
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|Low RI adhesives for Optical Waveguides
|Low RI adhesives for Optical Waveguides
|Optical Coupling
|Optical Coupling
|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1*fko0ja*_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
|NTT-AT
|-
|-
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/SDS)
|H70E ([[:File:H70E-EPOTEK.pdf|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Thermally Conductive, Electrically Insulating Epoxy
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/SDS)
|H20E ([[:File:H20E EPOTEK.pdf|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf|SDS]])
|Epoxy
|Epoxy
|Electrically Conductive, Silver filled
|Electrically Conductive, Silver filled
|Die Attach
|Die Attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/SDS)
|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf|TDS]]/[[:File:Hyb-353nd-sds-1.pdf|SDS]])
|Epoxy
|Epoxy
|high temperature dual cure
|High temperature dual cure
|Die attach
|Die attach
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/SDS)
|OG116-31 ([[:File:OG116-31 EPOTEK.pdf|TDS]]/[[:File:Og116-31-sds.pdf|SDS]])
|Epoxy
|Epoxy
|UV curable encapsulant
|UV curable encapsulant
|Encapsulation
|Encapsulation
|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
|EPOTEK
|-
|-
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf|TDS]]/SDS)
|Epoxy
|Epoxy
|mid-RI adhesives for Optical Waveguides
|Mid-RI adhesives for Optical Waveguides
|Optical Coupling
|Optical Coupling
|EMIUV
|[https://emiuv.com/ EMIUV]
|-
|-
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS/SDS]])
|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf|TDS]]/SDS)
|Epoxy
|Epoxy
|Low shrinkage low CTE UV and/or heat curable
|Low shrinkage low CTE UV and/or heat curable
|Die attach
|Die attach
|EMIUV
|[https://emiuv.com/ EMIUV]
|-
|-
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/SDS)
|3145 ([[:File:3145 RTV TDS.pdf|TDS]]/[[:File:3145 RTV MSDS.pdf|SDS]])
|RTV
|RTV
|Adhesive Sealant
|Adhesive Sealant
|Strain Relief
|Strain Relief
|DOW-Corning
|[https://www.dow.com/en-us.html DOW-Corning]
|-
|-
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/SDS)
|G751 ([[:File:G751 TDS ShinEtsu.pdf|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf|SDS]])
|Grease
|Grease
|Thermal Interface Material (TIM), non-curable
|Thermal Interface Material (TIM), non-curable
|TIM
|TIM
|ShinEtsuMicroSi
|[https://www.microsi.com/ ShinEtsuMicroSi]
|}
|}

== Knowledge Base ==

===== Material =====
[[:File:Low RI Epoxy NTT-AT.pdf|NTT-AT Low RI Material]]

[[:File:EPO-TEK® Selector Guide.pdf|EPOTEK Selector Guide]]

[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf|EPOTEK Adhesives for PCB Product]]

[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf|EPOTEK Adhesives for Optimized Thermal Management]]

[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf|EPOTEK Low Outgassing Adhesives]]

[[:File:OPTOCAST Variant EMIUV-compressed.pdf|EMIUV OPTOCAST Variants]]

[[:File:Capilary-Underfill Namics.pdf|Namics Capillary Underfill Material]]

[[:File:Glob-Top-Encapsulant-Materials Namics.pdf|Namics Glob Top and Encapsulant Material]]

[[:File:Pressure-less-Sintering NAMICS.pdf|Namics Pressure Less Sinter Material]]

[[:File:Sensors-line-card-final.pdf|Shin Etsu Material]]

[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf|Rogers Thermally Conductive Preform]]

===== Process =====
[[:File:UV Spot Cure vs Flood Light.pdf|UV Spot Cure vs Flood Light]]

[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf|UV Cured Epoxies vs Acrylic System]]

Latest revision as of 10:30, 9 April 2026

Facility Users are responsible for understanding the dangers and safety of the chemicals they use! You must take the time to look at the Material Safety Datasheets for the chemicals you are exposed to.

If you would like to know if you can bring a new chemical into the cleanroom, please contact the Facility Manager.

Stocked Chemicals at Protofab

To view Material Technical or safety Data Sheet, click on "TDS" or "SDS" respectively.

Chemical (TDS) Type Description Application Vendor
Propanol (SDS) Solvent 2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9% General Cleaning FISHER SCIENTIFIC
Acetone (SDS) Solvent ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5% General Cleaning FISHER SCIENTIFIC
Forming Gas (SDS) Gas 95% Nitrogen, 5% Hydrogen compressed gas mixture Die Attach Airgas
Argon (SDS) Gas Argon compressed gas Plasma Treatment Airgas
GA700H (TDS/SDS) Epoxy Low RI adhesives for Optical Waveguides Optical Coupling NTT-AT
H70E (TDS/SDS) Epoxy Thermally Conductive, Electrically Insulating Epoxy Die Attach EPOTEK
H20E (TDS/SDS) Epoxy Electrically Conductive, Silver filled Die Attach EPOTEK
HYB-353ND (TDS/SDS) Epoxy High temperature dual cure Die attach EPOTEK
OG116-31 (TDS/SDS) Epoxy UV curable encapsulant Encapsulation EPOTEK
3553-LV-UTF_HM (TDS/SDS) Epoxy Mid-RI adhesives for Optical Waveguides Optical Coupling EMIUV
OPTOCAST 3410 (TDS/SDS) Epoxy Low shrinkage low CTE UV and/or heat curable Die attach EMIUV
3145 (TDS/SDS) RTV Adhesive Sealant Strain Relief DOW-Corning
G751 (TDS/SDS) Grease Thermal Interface Material (TIM), non-curable TIM ShinEtsuMicroSi

Knowledge Base

Material

NTT-AT Low RI Material

EPOTEK Selector Guide

EPOTEK Adhesives for PCB Product

EPOTEK Adhesives for Optimized Thermal Management

EPOTEK Low Outgassing Adhesives

EMIUV OPTOCAST Variants

Namics Capillary Underfill Material

Namics Glob Top and Encapsulant Material

Namics Pressure Less Sinter Material

Shin Etsu Material

Rogers Thermally Conductive Preform

Process

UV Spot Cure vs Flood Light

UV Cured Epoxies vs Acrylic System

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