Equipment List: Difference between revisions
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== Die Attach ==
===== Semi
* [[Flip-Chip and Die Bonder (Tresky T-5300-W)]]
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===== Manual Die Attach Station =====
* [[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)]]
* [[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)]]
===== Thermal Processing =====
* [[Bake Chamber (Yamato DKN
== Wire Bonding ==
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===== Automatic Wire Bonder =====
* [[Ball & Wedge Bonding (F&S 56i Wire Bonder)]]
===== Surface
* [[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)]]
== Optical Interconnects ==
=====
* [[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)]]
===== Photonics Wire Bond and Surface Attached Lens Fabrication =====
* [[Photonics Wire Bond and Surface Attached Lens Fabrication]]
== Process Verification ==
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===== Die Attach and Wire Bond =====
* [[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)]]
== Metrology & Visual Inspection ==
===== Metrology =====
* [[3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)]]
===== Inspection and Assembly Visual Aid =====
* [[Stereozoom Microscopes]]
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