Equipment List: Difference between revisions

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Revision as of 10:02, 26 March 2026 view source Arin2 (talk \| contribs) Bureaucrats, Interface administrators, Administrators 388 edits First Draft Tag: Visual edit		Latest revision as of 13:38, 3 April 2026 view source Arin2 (talk \| contribs) Bureaucrats, Interface administrators, Administrators 388 edits mNo edit summary Tag: Visual edit
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Line 1: == Die Attach == ===== ~~Automatic/~~Semi-Automatic Die Attach and Pick n Place ===== * [[Flip-Chip and Die Bonder (Tresky T-5300-W)]] ===== Manual Die Attach Station ===== * [[Precision Fluid Dispensing (Nordson EFD Ultimus I/II)]] * [[UV Curing System (Panasonic Aicure UJ35 UV LED Spot Cure)]] ===== Thermal Processing ===== * [[Bake Chamber (Yamato DKN ~~402~~Series Forced Convection ~~Oven~~Ovens)]] == Wire Bonding == Line 18: ===== Automatic Wire Bonder ===== * [[Ball & Wedge Bonding (F&S 56i Wire Bonder)]] ===== Surface ~~preperation~~Preparation ===== * [[Plasma Treatment (Glen Technologies, Yield Engineering, R3A Asher)]] == Optical Interconnects == ===== ~~Fiber~~Optical ~~based and Free Space Optical~~Device Alignment and ~~Attach~~Bonding System ===== * [[Automated alignment and Attach (Fiberpro IFA-600-AUCME3)]] ===== Photonics Wire Bond and Surface Attached Lens Fabrication ===== * [[Photonics Wire Bond and Surface Attached Lens Fabrication]] * 3D Lithography Based Nano Fabrication ([https://www.vanguard-automation.com/sonata1000/ Vanguard Sonata1000]) * Automated Pre/post Development and Encapsulation ([https://www.vanguard-automation.com/reprise1000/ Vanguard Reprise1000]) == Process Verification == Line 39 ⟶ 38: ===== Die Attach and Wire Bond ===== * [[Die Shear and wire Pull Tester (F&S 5600i Pull/Shear Tester)]] == Metrology & Visual Inspection == ===== Metrology ===== * [[3D Profiling and Surface Roughness (Keyence VK-X3000 Confocal Microscope)]] ===== Inspection and Assembly Visual Aid ===== * [[Stereozoom Microscopes]] * Visual and Assembly Aid (Leica Stereo zoom Microscope)