Chemicals & MSDS - Revision history

Lorena: Fixed table arrangement

2026-09-04T15:33:22Z

Fixed table arrangement

← Older revision		Revision as of 08:33, 4 September 2026
Line 42:		Line 42:
	\|Optical Coupling		\|Optical Coupling
	\|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1fko0ja_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]		\|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1fko0ja_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
			\|-
		⚫	\|3553-LVUTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf\|SDS]])
		⚫	\|Epoxy
		⚫	\|Mid-RI Adhesives for Optical Waveguides
		⚫	\|Optical Coupling
		⚫	\|[https://emiuv.com/ EMIUV]
	\|-		\|-
	\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf\|SDS]])		\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf\|SDS]])
Line 72:		Line 78:
	\|Glob Top		\|Glob Top
	\|[https://emiuv.com/ EMIUV]\|-		\|[https://emiuv.com/ EMIUV]\|-
⚫	\|3553-~~LV-UTF_HM~~ ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf\|SDS]])
⚫	\|Epoxy
⚫	\|Mid-RI ~~adhesives~~ for Optical Waveguides
⚫	\|Optical Coupling
⚫	\|[https://emiuv.com/ EMIUV]
	\|-		\|-
	\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3410 EMIUV MSDS.pdf\|SDS]])		\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3410 EMIUV MSDS.pdf\|SDS]])

Arin2: added CHIPSHIELD 2401 to chemicals

2026-09-03T18:04:45Z

added CHIPSHIELD 2401 to chemicals

← Older revision		Revision as of 11:04, 3 September 2026
Line 64:		Line 64:
	\|Epoxy		\|Epoxy
	\|UV curable encapsulant		\|UV curable encapsulant
			\|Glob Top
	\|Encapsulation
	\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]		\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|-		\|-
			\|CHIPSHIELD 2401 ([[:File:2401 TDS-GlobTop EMIUV.pdf\|TDS]]/[[:File:CHIPSHIELD MSDS.pdf\|SDS]])
			\|Epoxy
			\|UV curable encapsulant
			\|Glob Top
			\|[https://emiuv.com/ EMIUV]\|-
	\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf\|SDS]])		\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf\|SDS]])
	\|Epoxy		\|Epoxy

Arin2: GA700H Docs

2026-08-28T19:53:29Z

GA700H Docs

← Older revision		Revision as of 12:53, 28 August 2026
Line 37:		Line 37:
	\|[https://www.airgas.com/ Airgas]		\|[https://www.airgas.com/ Airgas]
	\|-		\|-
	\|GA700H ([[:File:~~E3810-GA700H LowRI adhesive~~ NTT-AT.pdf\|TDS]]/SDS)		\|GA700H ([[:File:NTT-AT GA700H TDS.pdf\|TDS]]/[[:File:NTT-AT GA700H MSDS.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|Low RI adhesives for Optical Waveguides		\|Low RI adhesives for Optical Waveguides

Arin2: added MSDS

2026-08-25T20:08:52Z

added MSDS

← Older revision		Revision as of 13:08, 25 August 2026
Line 67:		Line 67:
	\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]		\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|-		\|-
	\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/SDS)		\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3553-LV-UTF EMIUV MSDS.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|Mid-RI adhesives for Optical Waveguides		\|Mid-RI adhesives for Optical Waveguides
Line 73:		Line 73:
	\|[https://emiuv.com/ EMIUV]		\|[https://emiuv.com/ EMIUV]
	\|-		\|-
	\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/SDS)		\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/[[:File:OPTOCAST 3410 EMIUV MSDS.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|Low shrinkage low CTE UV and/or heat curable		\|Low shrinkage low CTE UV and/or heat curable

Arin2: Added NAMICS

2026-08-24T21:44:03Z

Added NAMICS

← Older revision		Revision as of 14:44, 24 August 2026
Line 90:		Line 90:
	\|TIM		\|TIM
	\|[https://www.microsi.com/ ShinEtsuMicroSi]		\|[https://www.microsi.com/ ShinEtsuMicroSi]
			\|-
			\|UNIMEC H9890-6A ([[:File:NAMICS UNIMEC H9890-6A.pdf\|TDS]]/[[:File:H9890-6A MSDS.pdf\|SDS]])
			\|Low-temperature Sinter
			\|High thermal conductive paste
			\|Die Attach
			\|[https://namics-corp.com/low-temperature-pressure-less-sintering/#contact NAMICS]
	\|}		\|}

Arin2 at 17:30, 9 April 2026

2026-04-09T17:30:15Z

← Older revision		Revision as of 10:30, 9 April 2026
Line 99:		Line 99:
	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]		[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

Arin2 at 17:27, 9 April 2026

2026-04-09T17:27:30Z

← Older revision		Revision as of 10:27, 9 April 2026
Line 99:		Line 99:
	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	EPOTEK Adhesives for PCB Product		[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

Arin2: /* Material */

2026-04-01T00:37:09Z

Material

← Older revision		Revision as of 17:37, 31 March 2026
Line 102:		Line 102:

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf\|EPOTEK Low Outgassing Adhesives]]

	[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]		[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]

Arin2 at 22:00, 31 March 2026

2026-03-31T22:00:26Z

← Older revision		Revision as of 15:00, 31 March 2026
Line 112:		Line 112:

	[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]		[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]

			[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf\|Rogers Thermally Conductive Preform]]

	===== Process =====		===== Process =====

Arin2 at 21:54, 31 March 2026

2026-03-31T21:54:19Z

← Older revision		Revision as of 14:54, 31 March 2026
Line 91:		Line 91:
	\|[https://www.microsi.com/ ShinEtsuMicroSi]		\|[https://www.microsi.com/ ShinEtsuMicroSi]
	\|}		\|}

			== Knowledge Base ==

			===== Material =====
			[[:File:Low RI Epoxy NTT-AT.pdf\|NTT-AT Low RI Material]]

			[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

			EPOTEK Adhesives for PCB Product

			[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]

			[[:File:Capilary-Underfill Namics.pdf\|Namics Capillary Underfill Material]]

			[[:File:Glob-Top-Encapsulant-Materials Namics.pdf\|Namics Glob Top and Encapsulant Material]]

			[[:File:Pressure-less-Sintering NAMICS.pdf\|Namics Pressure Less Sinter Material]]

			[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]

			===== Process =====
			[[:File:UV Spot Cure vs Flood Light.pdf\|UV Spot Cure vs Flood Light]]

			[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf\|UV Cured Epoxies vs Acrylic System]]

← Older revision		Revision as of 10:30, 9 April 2026
Line 99:		Line 99:
	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]		[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

← Older revision		Revision as of 17:37, 31 March 2026
Line 102:		Line 102:

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf\|EPOTEK Low Outgassing Adhesives]]

	[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]		[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]