Chemicals & MSDS - Revision history

Arin2 at 17:30, 9 April 2026

2026-04-09T17:30:15Z

← Older revision		Revision as of 10:30, 9 April 2026
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	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]		[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

Arin2 at 17:27, 9 April 2026

2026-04-09T17:27:30Z

← Older revision		Revision as of 10:27, 9 April 2026
Line 99:		Line 99:
	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	EPOTEK Adhesives for PCB Product		[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

Arin2: /* Material */

2026-04-01T00:37:09Z

Material

← Older revision		Revision as of 17:37, 31 March 2026
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	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf\|EPOTEK Low Outgassing Adhesives]]

	[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]		[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]

Arin2 at 22:00, 31 March 2026

2026-03-31T22:00:26Z

← Older revision		Revision as of 15:00, 31 March 2026
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	[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]		[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]

			[[:File:COOLSPAN Thermally Electrically Conductive Adhesive TECA Data Sheet.pdf\|Rogers Thermally Conductive Preform]]

	===== Process =====		===== Process =====

Arin2 at 21:54, 31 March 2026

2026-03-31T21:54:19Z

← Older revision		Revision as of 14:54, 31 March 2026
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	\|[https://www.microsi.com/ ShinEtsuMicroSi]		\|[https://www.microsi.com/ ShinEtsuMicroSi]
	\|}		\|}

			== Knowledge Base ==

			===== Material =====
			[[:File:Low RI Epoxy NTT-AT.pdf\|NTT-AT Low RI Material]]

			[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

			EPOTEK Adhesives for PCB Product

			[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]

			[[:File:Capilary-Underfill Namics.pdf\|Namics Capillary Underfill Material]]

			[[:File:Glob-Top-Encapsulant-Materials Namics.pdf\|Namics Glob Top and Encapsulant Material]]

			[[:File:Pressure-less-Sintering NAMICS.pdf\|Namics Pressure Less Sinter Material]]

			[[:File:Sensors-line-card-final.pdf\|Shin Etsu Material]]

			===== Process =====
			[[:File:UV Spot Cure vs Flood Light.pdf\|UV Spot Cure vs Flood Light]]

			[[:File:Ultraviolet Light Cured EPOXIES vs. Acrylic Based Systems.pdf\|UV Cured Epoxies vs Acrylic System]]

Arin2 at 20:48, 31 March 2026

2026-03-31T20:48:36Z

← Older revision		Revision as of 13:48, 31 March 2026
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	\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/[[:File:Hyb-353nd-sds-1.pdf\|SDS]])		\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/[[:File:Hyb-353nd-sds-1.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|~~high~~ temperature dual cure		\|High temperature dual cure
	\|Die attach		\|Die attach
	\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]		\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
Line 69:		Line 69:
	\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/SDS)		\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/SDS)
	\|Epoxy		\|Epoxy
	\|~~mid~~-RI adhesives for Optical Waveguides		\|Mid-RI adhesives for Optical Waveguides
	\|Optical Coupling		\|Optical Coupling
	\|[https://emiuv.com/ EMIUV]		\|[https://emiuv.com/ EMIUV]

Arin2: Initial Draft

2026-03-31T20:47:59Z

Initial Draft

← Older revision		Revision as of 13:47, 31 March 2026
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	\|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%		\|2-PROPANOL OPTIM AGRADE Percent Purity ≥99.9%
	\|General Cleaning		\|General Cleaning
	\|FISHER SCIENTIFIC		\|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
	\|-		\|-
	\|Acetone ([[:File:ACETONE - High Purity - SDS .pdf\|SDS]])		\|Acetone ([[:File:ACETONE - High Purity - SDS .pdf\|SDS]])
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	\|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%		\|ACETONE ACS SAFE-COTE 4L Percent Purity ≥99.5%
	\|General Cleaning		\|General Cleaning
	\|FISHER SCIENTIFIC		\|[https://www.fishersci.com/us/en/home.html FISHER SCIENTIFIC]
	\|-		\|-
	\|Forming Gas ([[:File:Forming Gas-MSDS.pdf\|SDS]])		\|Forming Gas ([[:File:Forming Gas-MSDS.pdf\|SDS]])
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	\|95% Nitrogen, 5% Hydrogen compressed gas mixture		\|95% Nitrogen, 5% Hydrogen compressed gas mixture
	\|Die Attach		\|Die Attach
	\|Airgas		\|[https://www.airgas.com/ Airgas]
	\|-		\|-
	\|Argon ([[:File:Argon MSDS.pdf\|SDS]])		\|Argon ([[:File:Argon MSDS.pdf\|SDS]])
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	\|Argon compressed gas		\|Argon compressed gas
	\|Plasma Treatment		\|Plasma Treatment
	\|Airgas		\|[https://www.airgas.com/ Airgas]
	\|-		\|-
	\|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf\|TDS]]/SDS)		\|GA700H ([[:File:E3810-GA700H LowRI adhesive NTT-AT.pdf\|TDS]]/SDS)
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	\|Low RI adhesives for Optical Waveguides		\|Low RI adhesives for Optical Waveguides
	\|Optical Coupling		\|Optical Coupling
			\|[https://www.ntt-at.co.jp/mt6/mt-estraier.cgi?offset=1&blog_id=9&searchtarget=9&disable_search=2&limit=&category=%27780%27&lp=1&_gl=1fko0ja_ga_PWH86FJDMZ*czE3NzQ5ODk5NjEkbzEkZzAkdDE3NzQ5ODk5NjEkajYwJGwwJGgw NTT-AT]
	\|NTT-AT
	\|-		\|-
	\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf\|SDS]])		\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf\|SDS]])
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	\|Thermally Conductive, Electrically Insulating Epoxy		\|Thermally Conductive, Electrically Insulating Epoxy
	\|Die Attach		\|Die Attach
			\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|EPOTEK
	\|-		\|-
	\|H20E ([[:File:H20E EPOTEK.pdf\|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf\|SDS]])		\|H20E ([[:File:H20E EPOTEK.pdf\|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf\|SDS]])
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	\|Electrically Conductive, Silver filled		\|Electrically Conductive, Silver filled
	\|Die Attach		\|Die Attach
			\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|EPOTEK
	\|-		\|-
	\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/[[:File:Hyb-353nd-sds-1.pdf\|SDS]])		\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/[[:File:Hyb-353nd-sds-1.pdf\|SDS]])
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	\|high temperature dual cure		\|high temperature dual cure
	\|Die attach		\|Die attach
			\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|EPOTEK
	\|-		\|-
	\|OG116-31 ([[:File:OG116-31 EPOTEK.pdf\|TDS]]/[[:File:Og116-31-sds.pdf\|SDS]])		\|OG116-31 ([[:File:OG116-31 EPOTEK.pdf\|TDS]]/[[:File:Og116-31-sds.pdf\|SDS]])
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	\|UV curable encapsulant		\|UV curable encapsulant
	\|Encapsulation		\|Encapsulation
			\|[https://meridianadhesives.com/epoxy-technology/ EPOTEK]
	\|EPOTEK
	\|-		\|-
	\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/SDS)		\|3553-LV-UTF_HM ([[:File:OPTOCAST3553&-HM EMIUV.pdf\|TDS]]/SDS)
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	\|mid-RI adhesives for Optical Waveguides		\|mid-RI adhesives for Optical Waveguides
	\|Optical Coupling		\|Optical Coupling
	\|EMIUV		\|[https://emiuv.com/ EMIUV]
	\|-		\|-
	\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/SDS)		\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/SDS)
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	\|Low shrinkage low CTE UV and/or heat curable		\|Low shrinkage low CTE UV and/or heat curable
	\|Die attach		\|Die attach
	\|EMIUV		\|[https://emiuv.com/ EMIUV]
	\|-		\|-
	\|3145 ([[:File:3145 RTV TDS.pdf\|TDS]]/[[:File:3145 RTV MSDS.pdf\|SDS]])		\|3145 ([[:File:3145 RTV TDS.pdf\|TDS]]/[[:File:3145 RTV MSDS.pdf\|SDS]])
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	\|Adhesive Sealant		\|Adhesive Sealant
	\|Strain Relief		\|Strain Relief
	\|DOW-Corning		\|[https://www.dow.com/en-us.html DOW-Corning]
	\|-		\|-
	\|G751 ([[:File:G751 TDS ShinEtsu.pdf\|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf\|SDS]])		\|G751 ([[:File:G751 TDS ShinEtsu.pdf\|TDS]]/[[:File:SDS G-751-ShinEtsu TIM.pdf\|SDS]])
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	\|Thermal Interface Material (TIM), non-curable		\|Thermal Interface Material (TIM), non-curable
	\|TIM		\|TIM
	\|ShinEtsuMicroSi		\|[https://www.microsi.com/ ShinEtsuMicroSi]
	\|}		\|}

Arin2 at 20:42, 31 March 2026

2026-03-31T20:42:46Z

← Older revision		Revision as of 13:42, 31 March 2026
Line 4:		Line 4:

	=== Stocked Chemicals at Protofab ===		=== Stocked Chemicals at Protofab ===
	To view Material Technical or safety Data Sheet, click on "'''TDS" or SDS respectively'''.		To view Material Technical or safety Data Sheet, click on "'''TDS" or "SDS" respectively'''.
	{\| class="wikitable sortable mw-collapsible"		{\| class="wikitable sortable mw-collapsible"
	\|+		\|+

Arin2 at 20:28, 31 March 2026

2026-03-31T20:28:46Z

← Older revision		Revision as of 13:28, 31 March 2026
Line 43:		Line 43:
	\|NTT-AT		\|NTT-AT
	\|-		\|-
	\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/SDS)		\|H70E ([[:File:H70E-EPOTEK.pdf\|TDS]]/[[:File:H70e SDS-pmf-syringe.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|Thermally Conductive, Electrically Insulating Epoxy		\|Thermally Conductive, Electrically Insulating Epoxy
Line 49:		Line 49:
	\|EPOTEK		\|EPOTEK
	\|-		\|-
	\|H20E ([[:File:H20E EPOTEK.pdf\|TDS]]/SDS)		\|H20E ([[:File:H20E EPOTEK.pdf\|TDS]]/[[:File:H20e SDS-pmf-syringe.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|Electrically Conductive, Silver filled		\|Electrically Conductive, Silver filled
Line 55:		Line 55:
	\|EPOTEK		\|EPOTEK
	\|-		\|-
	\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/SDS)		\|HYB-353ND ([[:File:HYB-353ND EPOTEK.pdf\|TDS]]/[[:File:Hyb-353nd-sds-1.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|high temperature dual cure		\|high temperature dual cure
Line 61:		Line 61:
	\|EPOTEK		\|EPOTEK
	\|-		\|-
	\|OG116-31 ([[:File:OG116-31 EPOTEK.pdf\|TDS]]/SDS)		\|OG116-31 ([[:File:OG116-31 EPOTEK.pdf\|TDS]]/[[:File:Og116-31-sds.pdf\|SDS]])
	\|Epoxy		\|Epoxy
	\|UV curable encapsulant		\|UV curable encapsulant

Arin2 at 20:18, 31 March 2026

2026-03-31T20:18:33Z

← Older revision		Revision as of 13:18, 31 March 2026
Line 73:		Line 73:
	\|EMIUV		\|EMIUV
	\|-		\|-
	\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS~~/SDS~~]])		\|OPTOCAST 3410 ([[:File:OPTOCAST3410-EMIUV.pdf\|TDS]]/SDS)
	\|Epoxy		\|Epoxy
	\|Low shrinkage low CTE UV and/or heat curable		\|Low shrinkage low CTE UV and/or heat curable

← Older revision		Revision as of 10:30, 9 April 2026
Line 99:		Line 99:
	[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]		[[:File:EPO-TEK® Selector Guide.pdf\|EPOTEK Selector Guide]]

	[[:File:EPO-TEK®-Adhesives-Applications-PCB.pdf\|EPOTEK Adhesives for PCB Product]]		[[:File:EPO-TEK®-Adhesives-Applications-PCB-Original.pdf\|EPOTEK Adhesives for PCB Product]]

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

← Older revision		Revision as of 17:37, 31 March 2026
Line 102:		Line 102:

	[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]		[[:File:Optimizing-Thermal-Management…-with-EPO-TEK®-Thermally-Conductive-Adhesives-compressed.pdf\|EPOTEK Adhesives for Optimized Thermal Management]]

			[[:File:EPO-TEK®-Low-Outgassing-Adhesives-Compressed.pdf\|EPOTEK Low Outgassing Adhesives]]

	[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]		[[:File:OPTOCAST Variant EMIUV-compressed.pdf\|EMIUV OPTOCAST Variants]]