View source for Flip-Chip and Die Bonder (Tresky T-5300-W)

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Flip-Chip and Die Bonder
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<div style="text-align:center; padding:6px;"> [[File:Tresky_T-5300-W.png|thumb|Tresky T-5300-W Die Bonder|none|300x300px]] </div>
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! style="text-align:left; padding:4px 6px; background:#eee; width:40%;" | Tool Type
| style="padding:4px 6px;" | Die Bonding
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! style="text-align:left; padding:4px 6px; background:#eee;" | Location
| style="padding:4px 6px;" | Softwall Cleanroom
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! style="text-align:left; padding:4px 6px; background:#eee;" | Supervisor
| style="padding:4px 6px;" |
'''Arin Abed'''<br>[mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]
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! style="text-align:left; padding:4px 6px; background:#eee;" | Description
| style="padding:4px 6px;" | Tresky T-5300-W
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<div style="font-weight:bold; margin-bottom:8px;">Tool Actions</div>

<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=91 Sign Up]</div>
<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=91 Get Trained]</div>
<div style="margin:6px;">[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/report-tool-issue.cgi?tool_ID=91 Report an Issue]</div>
<div style="margin:6px;">[[Recipes: Flip-Chip and Die Bonding|Recipes]]</div>
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'''Note: This tool will be available in July 2026.''' 

== About ==
Tresky T-5300-W is a die bonder and component placer with motorized and programmable Z-axis, making it  extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300-W really shines in applications with highest precision requirements, such as flip-chip or laser diode placement.  A high-resolution beam splitter unit allows sub-micron placement accuracy. The T-5300-W features up to a 200mm wafer table which sits below the main table with electronic die ejection system.

Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of well thought out features like a true, linear Z-Axis, Active Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.

== Application ==

* Flip-Chip with ultrasonic die attach 
* Flip-Chip with adhesives or anisotropic foils
* Eutectic bonding (AuSn, AuAg or Copper Pillar)
* Die Attach with adhesive (stamped or dispensed)
* Ultrasonic Bonding
* Die Sorting from wafer into waffle pack or gel pack.

== System Overview ==

* Maximum Placement Accuracy: <1um

* Bond force: 10-1000g

* XY Movement (Placement Stage): 220mm x 220mm (manual)

* Work Holder Area: Up to 400mm x 280mm

* Z-Movement :120mm, automatic with 1um resolution

* Bond head Rotation: 360° (unlimited)

* Substrate Holder:
** 100mm x 100mm Universal, Vacuum Base
** 52mm x 52mm Heating Plate (400°C max) with cooling

* Wafer (8” max) XY table drawer with die ejector 

== Operating Procedure & User's Manuals ==
[http://protowiki3.app.nanofab.ucsb.edu/images/d/d7/SOP_OAS-PF-0110-00_Tresky_T-5300-W.pdf Tresky T-5300-W SOP]

== Recipes ==
[[Recipes: Flip-Chip and Die Bonding]]

== Tooling ==
Protofab stocks variety of standard tooling. it is an expanding list so ask the staff about exiting tools and possible fit to your application. The complete list can be found on [[:File:StandardPickUp Tools-Tresky.pdf|Tresky Tools]].