https://protowiki.oasis.ucsb.edu/api.php?action=feedcontributions&feedformat=atom&user=Vraj 2026-05-28T23:29:47Z User contributions MediaWiki 1.43.8 https://protowiki.oasis.ucsb.edu/index.php?title=Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W)&diff=301 2026-04-08T17:34:16Z

<p>Vraj: Reverted edit by Vraj (talk) to last revision by Arin2</p> <hr /> <div>== About ==<br /> [[File:Tresky_T-5300-W.png|thumb|Tresky T-5300-W Die Bonder|none|300x300px]]<br /> Tresky T-5300-W is a die bonder and component placer with motorized and programmable Z-axis, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300-W really shines in applications with highest precision requirements, such as flip-chip or laser diode placement. A high-resolution beam splitter unit allows sub-micron placement accuracy. The T-5300-W features up to a 200mm wafer table which sits below the main table with electronic die ejection system.<br /> <br /> Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of well thought out features like a true, linear Z-Axis, Active Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.<br /> <br /> == Application ==<br /> <br /> * Flip-Chip with ultrasonic die attach <br /> * Flip-Chip with adhesives or anisotropic foils<br /> * Eutectic bonding (AuSn, AuAg or Copper Pillar)<br /> * Die Attach with adhesive (stamped or dispensed)<br /> * Ultrasonic Bonding<br /> * Die Sorting from wafer into waffle pack or gel pack.<br /> <br /> == System Overview ==<br /> <br /> * Maximum Placement Accuracy: &lt;1um<br /> <br /> * Bond force: 10-1000g<br /> <br /> * XY Movement (Placement Stage): 220mm x 220mm (manual)<br /> <br /> * Work Holder Area: Up to 400mm x 280mm<br /> <br /> * Z-Movement :120mm, automatic with 1um resolution<br /> <br /> * Bond head Rotation: 360° (unlimited)<br /> <br /> * Substrate Holder:<br /> ** 100mm x 100mm Universal, Vacuum Base<br /> ** 52mm x 52mm Heating Plate (400°C max) with cooling<br /> <br /> * Wafer (8” max) XY table drawer with die ejector <br /> <br /> == Operating Procedure &amp; User's Manuals ==<br /> [http://protowiki3.app.nanofab.ucsb.edu/images/d/d7/SOP_OAS-PF-0110-00_Tresky_T-5300-W.pdf Tresky T-5300-W SOP]<br /> <br /> == Recipes ==<br /> [[Recipes: Flip-Chip and Die Bonding]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W)&diff=300 2026-04-08T17:33:45Z

<p>Vraj: </p> <hr /> <div>== {{ToolInfo|Tool Type=Test|Location=ProtoFab|Supervisor=Test|Supervisor Phone=Test|Supervisor E-Mail=Test|Description=Test|Manufacturer=Test|Model=Test}} ==<br /> == About ==<br /> [[File:Tresky_T-5300-W.png|thumb|Tresky T-5300-W Die Bonder|none|300x300px]]<br /> Tresky T-5300-W is a die bonder and component placer with motorized and programmable Z-axis, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300-W really shines in applications with highest precision requirements, such as flip-chip or laser diode placement. A high-resolution beam splitter unit allows sub-micron placement accuracy. The T-5300-W features up to a 200mm wafer table which sits below the main table with electronic die ejection system.<br /> <br /> Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of well thought out features like a true, linear Z-Axis, Active Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.<br /> <br /> == Application ==<br /> <br /> * Flip-Chip with ultrasonic die attach <br /> * Flip-Chip with adhesives or anisotropic foils<br /> * Eutectic bonding (AuSn, AuAg or Copper Pillar)<br /> * Die Attach with adhesive (stamped or dispensed)<br /> * Ultrasonic Bonding<br /> * Die Sorting from wafer into waffle pack or gel pack.<br /> <br /> == System Overview ==<br /> <br /> * Maximum Placement Accuracy: &lt;1um<br /> <br /> * Bond force: 10-1000g<br /> <br /> * XY Movement (Placement Stage): 220mm x 220mm (manual)<br /> <br /> * Work Holder Area: Up to 400mm x 280mm<br /> <br /> * Z-Movement :120mm, automatic with 1um resolution<br /> <br /> * Bond head Rotation: 360° (unlimited)<br /> <br /> * Substrate Holder:<br /> ** 100mm x 100mm Universal, Vacuum Base<br /> ** 52mm x 52mm Heating Plate (400°C max) with cooling<br /> <br /> * Wafer (8” max) XY table drawer with die ejector <br /> <br /> == Operating Procedure &amp; User's Manuals ==<br /> [http://protowiki3.app.nanofab.ucsb.edu/images/d/d7/SOP_OAS-PF-0110-00_Tresky_T-5300-W.pdf Tresky T-5300-W SOP]<br /> <br /> == Recipes ==<br /> [[Recipes: Flip-Chip and Die Bonding]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Common.css&diff=297 2026-04-07T22:44:13Z

<p>Vraj: </p> <hr /> <div>/* CSS placed here will be applied to all skins */<br /> <br /> .mw-page-container {<br /> max-width: 100%;<br /> }<br /> <br /> .vector-header-container,<br /> .vector-sticky-header-container {<br /> border-bottom: 1px solid #eaecf0;<br /> }<br /> <br /> .mw-body {<br /> font-size: 0.98rem;<br /> line-height: 1.6;<br /> }<br /> <br /> .wikitable {<br /> font-size: 0.95rem;<br /> border-collapse: collapse;<br /> }<br /> <br /> .wikitable th,<br /> .wikitable td {<br /> padding: 0.5em 0.75em;<br /> }<br /> <br /> img,<br /> video,<br /> iframe {<br /> max-width: 100%;<br /> height: auto;<br /> }<br /> <br /> pre,<br /> code {<br /> overflow-x: auto;<br /> }<br /> <br /> /* Main page layout */<br /> .mp-banner {<br /> background: lightblue;<br /> border: 1px solid #000;<br /> padding: 2rem 1rem;<br /> text-align: center;<br /> font-size: 2.2rem;<br /> font-weight: 700;<br /> color: #000;<br /> margin: 0 0 1rem 0;<br /> }<br /> <br /> .mp-toplinks {<br /> display: grid;<br /> grid-template-columns: repeat(3, 1fr);<br /> background: lightblue;<br /> border: 1px solid #000;<br /> margin: 0 0 1.25rem 0;<br /> }<br /> <br /> .mp-toplink {<br /> display: flex;<br /> align-items: center;<br /> justify-content: center;<br /> text-align: center;<br /> min-height: 100px;<br /> padding: 1rem;<br /> border-right: 2px solid #000;<br /> box-sizing: border-box;<br /> }<br /> <br /> .mp-toplink:last-child {<br /> border-right: none;<br /> }<br /> <br /> .mp-sections {<br /> display: grid;<br /> grid-template-columns: 1fr 1fr 0.8fr;<br /> border: 1px solid #cedff2;<br /> background: #f5fffa;<br /> }<br /> <br /> .mp-section {<br /> padding: 1rem;<br /> border-right: 1px solid #a2a9b1;<br /> box-sizing: border-box;<br /> }<br /> <br /> .mp-section:last-child {<br /> border-right: none;<br /> }<br /> <br /> .mp-section h2 {<br /> margin: 0 0 0.75rem 0;<br /> padding: 0.5rem 0.75rem;<br /> text-align: center;<br /> font-size: 1.25rem;<br /> background: #eaecf0;<br /> border: 1px solid #a2a9b1;<br /> }<br /> <br /> .mp-section ul {<br /> margin: 0;<br /> padding-left: 1.2rem;<br /> }<br /> <br /> .mp-section li {<br /> margin: 0.45rem 0;<br /> }<br /> <br /> .mp-section a {<br /> white-space: normal;<br /> word-break: break-word;<br /> }<br /> <br /> @media (max-width: 768px) {<br /> .mw-body,<br /> .vector-body {<br /> padding-left: 0.75rem !important;<br /> padding-right: 0.75rem !important;<br /> }<br /> <br /> .mp-banner {<br /> font-size: 1.5rem;<br /> padding: 1.2rem 0.8rem;<br /> line-height: 1.4;<br /> }<br /> <br /> .mp-toplinks,<br /> .mp-sections {<br /> grid-template-columns: 1fr;<br /> }<br /> <br /> .mp-toplink,<br /> .mp-section {<br /> border-right: none;<br /> border-bottom: 1px solid #a2a9b1;<br /> }<br /> <br /> .mp-toplink:last-child,<br /> .mp-section:last-child {<br /> border-bottom: none;<br /> }<br /> }</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Common.css&diff=296 2026-04-07T22:43:58Z

<p>Vraj: </p> <hr /> <div>/* Global */<br /> .mw-page-container {<br /> max-width: 100%;<br /> }<br /> <br /> .mw-body {<br /> font-size: 0.98rem;<br /> line-height: 1.6;<br /> }<br /> <br /> img,<br /> video,<br /> iframe {<br /> max-width: 100%;<br /> height: auto;<br /> }<br /> <br /> pre,<br /> code {<br /> overflow-x: auto;<br /> }<br /> <br /> /* Main page */<br /> .mp-banner {<br /> background: #cfe8f1;<br /> border: 1px solid #222;<br /> padding: 2rem 1rem;<br /> text-align: center;<br /> font-size: 2.2rem;<br /> font-weight: 700;<br /> margin: 0 0 1rem 0;<br /> }<br /> <br /> .mp-toplinks {<br /> display: grid;<br /> grid-template-columns: repeat(3, 1fr);<br /> background: #cfe8f1;<br /> border: 1px solid #222;<br /> margin: 0 0 1.5rem 0;<br /> }<br /> <br /> .mp-toplinks &gt; div {<br /> padding: 1.5rem 1rem;<br /> text-align: center;<br /> border-right: 1px solid #222;<br /> display: flex;<br /> align-items: center;<br /> justify-content: center;<br /> min-height: 90px;<br /> }<br /> <br /> .mp-toplinks &gt; div:last-child {<br /> border-right: none;<br /> }<br /> <br /> .mp-sections {<br /> display: grid;<br /> grid-template-columns: 1fr 1fr 0.8fr;<br /> border: 1px solid #a2a9b1;<br /> background: #f8f9fa;<br /> }<br /> <br /> .mp-section {<br /> padding: 1rem;<br /> border-right: 1px solid #a2a9b1;<br /> }<br /> <br /> .mp-section:last-child {<br /> border-right: none;<br /> }<br /> <br /> .mp-section h2 {<br /> margin: 0 0 0.75rem 0;<br /> font-size: 1.3rem;<br /> text-align: center;<br /> border-bottom: 1px solid #a2a9b1;<br /> padding-bottom: 0.5rem;<br /> }<br /> <br /> .mp-section ul {<br /> margin: 0;<br /> padding-left: 1.2rem;<br /> }<br /> <br /> .mp-section li {<br /> margin: 0.45rem 0;<br /> }<br /> <br /> @media (max-width: 768px) {<br /> .mw-body,<br /> .vector-body {<br /> padding-left: 0.75rem !important;<br /> padding-right: 0.75rem !important;<br /> }<br /> <br /> .mp-banner {<br /> font-size: 1.5rem;<br /> padding: 1.2rem 0.8rem;<br /> }<br /> <br /> .mp-toplinks,<br /> .mp-sections {<br /> grid-template-columns: 1fr;<br /> }<br /> <br /> .mp-toplinks &gt; div,<br /> .mp-section {<br /> border-right: none;<br /> border-bottom: 1px solid #a2a9b1;<br /> }<br /> <br /> .mp-toplinks &gt; div:last-child,<br /> .mp-section:last-child {<br /> border-bottom: none;<br /> }<br /> }</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Common.css&diff=295 2026-04-07T22:41:31Z

<p>Vraj: </p> <hr /> <div>/* CSS placed here will be applied to all skins */<br /> <br /> /* Keep header and page clean */<br /> .mw-page-container {<br /> max-width: 100%;<br /> }<br /> <br /> .vector-header-container,<br /> .vector-sticky-header-container {<br /> border-bottom: 1px solid #eaecf0;<br /> }<br /> <br /> .mw-body {<br /> font-size: 0.98rem;<br /> line-height: 1.6;<br /> }<br /> <br /> /* Clean tables */<br /> .wikitable {<br /> font-size: 0.95rem;<br /> border-collapse: collapse;<br /> }<br /> <br /> .wikitable th,<br /> .wikitable td {<br /> padding: 0.5em 0.75em;<br /> }<br /> <br /> /* Make general content safer on small screens */<br /> img,<br /> video,<br /> iframe {<br /> max-width: 100%;<br /> height: auto;<br /> }<br /> <br /> pre,<br /> code {<br /> overflow-x: auto;<br /> }<br /> <br /> /* Mobile layout */<br /> @media (max-width: 768px) {<br /> /* Reduce page side padding */<br /> .mw-body,<br /> .vector-body {<br /> padding-left: 0.75rem !important;<br /> padding-right: 0.75rem !important;<br /> }<br /> <br /> /* Welcome banner */<br /> .mainpage-banner {<br /> width: 100% !important;<br /> box-sizing: border-box;<br /> padding: 1rem !important;<br /> font-size: 1.5rem !important;<br /> line-height: 1.4 !important;<br /> text-align: center;<br /> }<br /> <br /> /* Top quick links table must stop behaving like a table */<br /> .mainpage-links,<br /> .mainpage-links tbody,<br /> .mainpage-links tr {<br /> display: block !important;<br /> width: 100% !important;<br /> }<br /> <br /> .mainpage-links td,<br /> .mainpage-links th {<br /> display: block !important;<br /> width: 100% !important;<br /> box-sizing: border-box;<br /> text-align: center;<br /> padding: 1rem 0.75rem !important;<br /> border-left: none !important;<br /> border-right: none !important;<br /> border-top: 1px solid #a2a9b1 !important;<br /> white-space: normal !important;<br /> }<br /> <br /> .mainpage-links tr:first-child td:first-child,<br /> .mainpage-links tr:first-child th:first-child {<br /> border-top: none !important;<br /> }<br /> <br /> /* Main section table must also stop behaving like a table */<br /> .mainpage-sections,<br /> .mainpage-sections tbody,<br /> .mainpage-sections tr {<br /> display: block !important;<br /> width: 100% !important;<br /> }<br /> <br /> .mainpage-sections td,<br /> .mainpage-sections th {<br /> display: block !important;<br /> width: 100% !important;<br /> box-sizing: border-box;<br /> padding: 0.9rem !important;<br /> white-space: normal !important;<br /> border-left: none !important;<br /> border-right: none !important;<br /> }<br /> <br /> .mainpage-sections th {<br /> text-align: center;<br /> font-size: 1.1rem;<br /> }<br /> <br /> /* Let long links wrap normally */<br /> .mainpage-sections a,<br /> .mainpage-links a {<br /> white-space: normal !important;<br /> word-break: break-word;<br /> }<br /> <br /> /* Optional: make normal wikitable content scroll instead of crushing */<br /> .wikitable {<br /> display: block;<br /> width: 100%;<br /> overflow-x: auto;<br /> white-space: nowrap;<br /> }<br /> }</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Common.css&diff=294 2026-04-07T22:39:02Z

<p>Vraj: </p> <hr /> <div>/* CSS placed here will be applied to all skins */<br /> /* Keep header and page clean */<br /> .mw-page-container {<br /> max-width: 100%;<br /> }<br /> <br /> .vector-header-container,<br /> .vector-sticky-header-container {<br /> border-bottom: 1px solid #eaecf0;<br /> }<br /> <br /> .mw-body {<br /> font-size: 0.98rem;<br /> line-height: 1.6;<br /> }<br /> <br /> <br /> /* Clean tables */<br /> .wikitable {<br /> font-size: 0.95rem;<br /> border-collapse: collapse;<br /> }<br /> <br /> .wikitable th,<br /> .wikitable td {<br /> padding: 0.5em 0.75em;<br /> }<br /> <br /> <br /> /* Mobile layout */<br /> @media (max-width: 768px) {<br /> /* Reduce large title/banner padding */<br /> .mainpage-banner {<br /> padding: 1rem !important;<br /> font-size: 1.5rem !important;<br /> text-align: center;<br /> }<br /> <br /> /* Stack top quick links vertically */<br /> .mainpage-links td,<br /> .mainpage-links th {<br /> display: block;<br /> width: 100% !important;<br /> border-left: none !important;<br /> border-right: none !important;<br /> border-top: 1px solid #a2a9b1;<br /> box-sizing: border-box;<br /> text-align: center;<br /> padding: 1rem 0.75rem !important;<br /> }<br /> <br /> .mainpage-links tr:first-child td:first-child,<br /> .mainpage-links tr:first-child th:first-child {<br /> border-top: none;<br /> }<br /> <br /> /* Stack homepage content columns */<br /> .mainpage-sections td,<br /> .mainpage-sections th {<br /> display: block;<br /> width: 100% !important;<br /> white-space: normal;<br /> box-sizing: border-box;<br /> }<br /> <br /> /* Reduce page side padding */<br /> .mw-body,<br /> .vector-body {<br /> padding-left: 0.75rem;<br /> padding-right: 0.75rem;<br /> }<br /> <br /> /* Allow list links to wrap naturally */<br /> .mainpage-sections a {<br /> white-space: normal;<br /> word-break: break-word;<br /> }<br /> }</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Common.css&diff=293 2026-04-07T22:22:42Z

<p>Vraj: Created page with &quot;/* CSS placed here will be applied to all skins */ /* Keep header and page clean */ .mw-page-container { max-width: 100%; } .vector-header-container, .vector-sticky-header-container { border-bottom: 1px solid #eaecf0; } .mw-body { font-size: 0.98rem; line-height: 1.6; } /* Clean tables */ .wikitable { font-size: 0.95rem; border-collapse: collapse; } .wikitable th, .wikitable td { padding: 0.5em 0.75em; }&quot;</p> <hr /> <div>/* CSS placed here will be applied to all skins */<br /> /* Keep header and page clean */<br /> .mw-page-container {<br /> max-width: 100%;<br /> }<br /> <br /> .vector-header-container,<br /> .vector-sticky-header-container {<br /> border-bottom: 1px solid #eaecf0;<br /> }<br /> <br /> .mw-body {<br /> font-size: 0.98rem;<br /> line-height: 1.6;<br /> }<br /> <br /> <br /> /* Clean tables */<br /> .wikitable {<br /> font-size: 0.95rem;<br /> border-collapse: collapse;<br /> }<br /> <br /> .wikitable th,<br /> .wikitable td {<br /> padding: 0.5em 0.75em;<br /> }</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=File:134.pdf&diff=88 2026-03-25T23:37:39Z

<p>Vraj: TEST</p> <hr /> <div>== Summary ==<br /> TEST</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Sidebar&diff=86 2026-03-25T22:39:55Z

<p>Vraj: </p> <hr /> <div><br /> * navigation<br /> ** mainpage|mainpage-description<br /> ** SOPs|SOPs<br /> ** Protofab_Rules|Protofab Rules<br /> * SEARCH<br /> * TOOLBOX<br /> * LANGUAGES</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=MediaWiki:Sidebar&diff=85 2026-03-25T22:38:34Z

<p>Vraj: Created page with &quot; * navigation ** mainpage|mainpage-description ** recentchanges-url|recentchanges ** randompage-url|randompage ** helppage|help-mediawiki ** https://google.com|Google ** My_Page|My Custom Page * SEARCH * TOOLBOX * LANGUAGES&quot;</p> <hr /> <div><br /> * navigation<br /> ** mainpage|mainpage-description<br /> ** recentchanges-url|recentchanges<br /> ** randompage-url|randompage<br /> ** helppage|help-mediawiki<br /> ** https://google.com|Google<br /> ** My_Page|My Custom Page<br /> * SEARCH<br /> * TOOLBOX<br /> * LANGUAGES</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Protofab_Rules&diff=48 2026-03-25T18:43:52Z

<p>Vraj: </p> <hr /> <div>== Summary ==<br /> While working in the OASIS Prototyping facility, Protofab, you are surrounded by electro-mechanical systems, gases and chemicals. It is impossible to define a policy for every conceivable situation.<br /> <br /> '''The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility.''' The Protofab culture relies on self-discipline to follow policies, respect for each other, and careful considerate treatment of facility property that is needed for project success. Everyone’s work is equally important and the basic rule of treating others how you would like to be treated sets the framework for many policies in the facility.  As a group we expect all users and staff to help maintain the safety and integrity of the Protofab. All users should employ common sense and a high degree of prudence while working in this facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users may be denied further access to the facility.<br /> <br /> This document attempts to define acceptable actions and behavior for the users of the Protofab and contains extensive safety related information on work practices and procedures within the facility. <br /> <br /> [[File:Fire alarm.png|border|182x182px]] <br /> <br /> == General Protofab Information ==<br /> '''Orientation and Initial Training:''' All new users must take the initial fundamentals of laboratory safety course offered through the UC learning center. There are mandatory general orientation and training that is required. Contact the facility manager to request access.<br /> <br /> '''Access:''' Is 24/7. However, the OASIS building is electronically locked all the time. Users will receive a FOB for entry and will be signed up on Card Access System. '''Always scan in when entering the facility and scan out when exiting, when attending training sessions or performing beneficial work.''' Visitors are exempt from this rule. '''Violation of this policy will result in suspension.''' This policy is both for safety (knowing who is in the lab in case of emergencies) and for fair, accurate billing of facility resources. <br /> <br /> '''Visitor Policy'''<br /> <br /> ●       '''Badges:''' Visitor badges can be obtained from the staff during the normal weekday hours which removes any confusion about the shadowing of another user without logging in. As a nonpaying person, a visitor can’t touch any equipment or computer. We offer this policy as a courtesy so please do not abuse it as it can also be removed. <br /> <br /> ●       '''Shadowing:''' We encourage new users to shadow current users as visitors to become familiar with the Protofab before beginning actual work. To accomplish this, registered users may come in as visitors, with a badge, to observe and learn how processes are done.  A logged-in user and visitor may not exchange roles while in the cleanroom together. Only the actively logged-in user may operate/touch/use any equipment in the laboratory. No exceptions. <br /> <br /> ●       '''Visiting Professionals:''' Non-registered visitors such as research collaborators or new students in a research group can be brought into the facility to observe with the permission of staff during normal operating hours (8am-5pm M-F). Off-hours permission to bring in professional visitors will be evaluated on request by the management.<br /> <br /> ●       '''Groups:''' Any “group” tour (3 or more people) inside the facility needs prior approval of the management. Please allocate ample time when requesting. <br /> <br /> ●       '''Violations:''' The Protofab relies on the honor system and the visitor “observation only” policy is clear. '''If users are caught violating the visitor policy and operating anything in the facility while being a visitor, there will be corrective action for both the official user host and the visitor.'''</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=41 2026-03-25T08:21:03Z

<p>Vraj: </p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00'''&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details. Do not stare at the LED light or reflected beam. [[File:A58dd2c5-76b9-4a3b-ae77-1541845c84d6.png|border]]<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == Metrology &amp; Observation Procedures ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == Troubleshooting ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> <br /> [mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=40 2026-03-25T08:19:03Z

<p>Vraj: </p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00'''&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details. Do not stare at the LED light or reflected beam. [[File:A58dd2c5-76b9-4a3b-ae77-1541845c84d6.png|border|frameless]]<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == Metrology &amp; Observation Procedures ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == Troubleshooting ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> <br /> [mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=39 2026-03-25T08:18:24Z

<p>Vraj: /* Safety &amp; EHS */</p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00'''&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details. Do not stare at the LED light or reflected beam. [[File:A58dd2c5-76b9-4a3b-ae77-1541845c84d6.png|border|frameless]]<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == Metrology &amp; Observation Procedures ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == Troubleshooting ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> <br /> [mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=38 2026-03-25T08:16:33Z

<p>Vraj: /* Safety &amp; EHS */</p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00'''&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details. Do not stare at the LED light or reflected beam.[[File:A58dd2c5-76b9-4a3b-ae77-1541845c84d6.png|none|thumb]]<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == Metrology &amp; Observation Procedures ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == Troubleshooting ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> <br /> [mailto:arin_abed@ucsb.edu arin_abed@ucsb.edu]<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=22 2026-03-25T05:46:21Z

<p>Vraj: </p> <hr /> <div>=== [[SOPs]] ===<br /> <br /> === [[Facility Rules]] ===</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Facility_Rules&diff=21 2026-03-24T22:34:01Z

<p>Vraj: Created page with &quot;&#039;&#039;&#039;1. If you didn’t log it, it didn’t happen.&#039;&#039;&#039; Tool usage, parameters, issues—everything goes in the log. No exceptions. &#039;&#039;&#039;2. Never “just try something.”&#039;&#039;&#039; This isn’t a kitchen. Random tweaks = ruined wafers + pissed-off users. &#039;&#039;&#039;3. Respect the tool more than your timeline.&#039;&#039;&#039; Rushing = contamination, downtime, and everyone hates you. &#039;&#039;&#039;4. Clean as if the next user is your boss.&#039;&#039;&#039; Because sometimes they are. &#039;&#039;&#039;5. Don’t touch anything you wer...&quot;</p> <hr /> <div>'''1. If you didn’t log it, it didn’t happen.'''<br /> <br /> Tool usage, parameters, issues—everything goes in the log. No exceptions.<br /> <br /> '''2. Never “just try something.”'''<br /> <br /> This isn’t a kitchen. Random tweaks = ruined wafers + pissed-off users.<br /> <br /> '''3. Respect the tool more than your timeline.'''<br /> <br /> Rushing = contamination, downtime, and everyone hates you.<br /> <br /> '''4. Clean as if the next user is your boss.'''<br /> <br /> Because sometimes they are.<br /> <br /> '''5. Don’t touch anything you weren’t trained on.'''<br /> <br /> Confidence ≠ qualification.<br /> <br /> '''6. Label everything. Then label it again.'''<br /> <br /> Unlabeled samples = trash. No detective work.<br /> <br /> '''7. If it looks wrong, stop. Immediately.'''<br /> <br /> We fix problems early, not after a $10k mistake.<br /> <br /> '''8. Cross-contamination is a career-limiting move.'''<br /> <br /> Know your materials. Know your process class.<br /> <br /> '''9. Booking time ≠ owning the tool.'''<br /> <br /> If you’re late, you lose your slot. No drama.<br /> <br /> '''10. Always assume the last user messed something up. Verify before running.'''<br /> <br /> Trust—but verify.</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=20 2026-03-24T22:33:17Z

<p>Vraj: </p> <hr /> <div>=== [[SOPs]] ===<br /> [[Facility Rules]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOPs&diff=19 2026-03-24T22:32:11Z

<p>Vraj: Created page with &quot; === &#039;&#039;&#039;list of Tools&#039;&#039;&#039; === * New Tool * Keyence VK X3000&quot;</p> <hr /> <div><br /> === '''list of Tools''' ===<br /> <br /> * [[New Tool]]<br /> * [[SOP Keyence VK X3000|Keyence VK X3000]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=18 2026-03-24T22:31:46Z

<p>Vraj: /* SOPs */</p> <hr /> <div>=== [[SOPs]] ===</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=17 2026-03-24T22:31:17Z

<p>Vraj: /* SOP */</p> <hr /> <div>== SOPs ==</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=New_Tool&diff=13 2026-03-24T22:00:11Z

<p>Vraj: Added new tool</p> <hr /> <div>F&amp;S 56i Wire Bonder SOP#: OAS-PF-0210-00&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == '''Purpose''' ==<br /> This Standard Operating Procedure (SOP) defines the safe and proper use of the F&amp;S Automatic wire bonding system within Protofab. This tool is used to create fine-wire electrical interconnections for microelectronic, optoelectronic, and hybrid devices.<br /> <br /> == '''Scope''' ==<br /> This SOP applies to routine wire bonding operations, including setup, alignment, and bonding of approved materials by trained and authorized users. Advanced wafer level process development, non-standard configurations, maintenance, or hardware modifications are outside the scope of this SOP and require prior approval from Protofab staff.<br /> <br /> == Safety &amp; EHS ==<br /> <br /> * PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> <br /> * Hot Surface: The bonding workholder, heater stage, and adjacent components may reach elevated temperatures during operation. Contact with heated surfaces can result in skin burns. Users should assume all heated components remain hot until confirmed otherwise.<br /> * Sharp Objects: Fine bonding wire, capillaries, wedges, broken wire ends, and sample edges may be sharp. Contact with these components can result in cuts or puncture injuries. Tweezers, needles, and other hand tools used during setup also present puncture hazards.<br /> * Shrapnel/Flying Debris: Improper bonding parameters, capillary damage, wire breakage, or sample fracture may generate small fragments or debris. These fragments may become airborne at close range and pose a risk to eyes or skin.<br /> * Electrical and Mechanical Motion: The bonding head, stages, and wire clamp move during operation and may pinch or strike hands or tools. Electrical components are present within the system enclosure.<br /> <br /> # '''Tool Overview'''<br /> <br /> * XY motor driven table with 100x100mm travel range<br /> * Digital Ultrasonic Generator<br /> * 100x100mm heated workholder<br /> * '''Singlewire Bond Mode:''' Ideal for prototyping. A wire connection is made between two points, which are approached by the user with the joystick for each wire separately without having to create a bonding program with chips and wires on beforehand.<br /> <br /> * '''Multiwire Bond Mode:''' A complex bonding program with chips and wires is created to set the system ready for production level. The machine then executes image recognition program as often as required so places the bonds precisely in the previously taught positions.<br /> <br /> * '''Step-Mode:''' This mode splits the bond cycle into its individual parts to view them. This mode is often used for first bonding attempts to get an exact overview of the bonding process. Applies to both single/multiwire modes.<br /> <br /> '''Bond Heads and Modules'''<br /> <br /> * Ball-Wedge and Bumping Bonding<br /> ** Gold wire 12,5-50 µm<br /> ** Placement accuracy: +/- 5 µm<br /> ** Repeatability: +/- 3 µm<br /> ** Loop height accuracy: +/- 5 µm<br /> <br /> * Wedge-Wedge, Deep Access, Bonding<br /> ** Aluminum and gold wire 12,5-75µm<br /> ** Ribbons from 30x12,5µm to 250x25µm<br /> ** Placement accuracy: +/- 5 µm<br /> ** Repeatability: +/- 3 µm<br /> ** Loop height accuracy: +/- 5 µm<br /> <br /> * Die Shear and Wire Pull Force Tester<br /> ** Wire Pull up to 100gf<br /> ** Ball/Die Shear up to 500gf<br /> ** Die Shear up to 5000gf<br /> <br /> '''Tool Overview'''<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Verify utilities (power/CDA/vacuum) in range<br /> * Visual inspection: E.g., Cleanliness of workholder.<br /> * '''Verify that the correct bond head or module is installed. Contact Protofab staff if not.'''<br /> * Verify Tooling (Wedge, capillaries &amp; Pull/Shear)<br /> * Verify calibration status (if applicable)</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=12 2026-03-24T21:56:39Z

<p>Vraj: </p> <hr /> <div>=== '''SOP''' ===<br /> <br /> * [[SOP Keyence VK X3000|Keyence VK X3000]]<br /> * [[New Tool]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=11 2026-03-23T23:19:57Z

<p>Vraj: </p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00'''&lt;blockquote&gt;'''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.&lt;/blockquote&gt;<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> *Do not stare at the LED light or reflected beam.<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == Metrology &amp; Observation Procedures ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == Troubleshooting ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=10 2026-03-23T23:18:46Z

<p>Vraj: </p> <hr /> <div>=== '''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00''' ===<br /> <br /> ==== '''User Responsibility, Training, and Consequences of Misuse''' ====<br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> ==== '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.''' ====<br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> *Do not stare at the LED light or reflected beam.<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == '''Metrology &amp; Observation Procedures''' ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == '''Troubleshooting''' ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=9 2026-03-23T23:17:58Z

<p>Vraj: Fixing Formatting</p> <hr /> <div>== '''Keyence VK-X3000 Confocal Microscope | SOP#: OAS-PF-0410-00''' ==<br /> <br /> === '''User Responsibility, Training, and Consequences of Misuse''' ===<br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> === '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.''' ===<br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.<br /> <br /> == Purpose ==<br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> == Scope ==<br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == Safety &amp; EHS ==<br /> *PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> *Do not stare at the LED light or reflected beam.<br /> *Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> *Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> == Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == Standard operating procedure ==<br /> <br /> === Startup ===<br /> <br /> # Turn on the main power switch<br /> # Turn on the power switch on measurement unit.<br /> # Turn on power of the control PC.<br /> <br /> === Normal operation ===<br /> <br /> # Initializing Lens Position<br /> ## Strat the Viewer Application<br /> ## Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> ## and initialize the lens position and motorized XY stage (return them to their origin).<br /> ## Click [OK] in the confirmation message.<br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> == '''Metrology &amp; Observation Procedures''' ==<br /> <br /> === Refer to below documents for general operation and features of the system. ===<br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> === Refer to the documents below for detailed step-by-step guides to specific type of measurements. ===<br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> == '''Troubleshooting''' ==<br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=File:A58dd2c5-76b9-4a3b-ae77-1541845c84d6.png&diff=8 2026-03-23T22:55:14Z

<p>Vraj: </p> <hr /> <div>A58dd2c5-76b9-4a3b-ae77-1541845c84d6</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=7 2026-03-23T22:47:41Z

<p>Vraj: Test the Index</p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope SOP# : OAS-PF-0410-00''' <br /> <br /> '''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.<br /> <br /> # '''Purpose''' The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components. The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> # '''Scope''' This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab. The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> # Safety &amp; EHS<br /> ## PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> ## Do not stare at the LED light or reflected beam.<br /> ## Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> ## Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> <br /> == 3. Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> <br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == 4. Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == 5. Standard operating procedure ==<br /> <br /> === 5.1 Startup ===<br /> 1. Turn on the main power switch<br /> <br /> 2. Turn on the power switch on measurement unit.<br /> <br /> 3. Turn on power of the control PC.<br /> <br /> === 5.2 Normal operation ===<br /> 1. Initializing Lens Position<br /> <br /> # Strat the Viewer Application<br /> # Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> <br /> # and initialize the lens position and motorized XY stage (return them to their origin). <br /> <br /> # Click [OK] in the confirmation message.<br /> <br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> <br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> <br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> <br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === 5.3 Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> # '''Metrology &amp; Observation Procedures'''<br /> <br /> Refer to below documents for general operation and features of the system.<br /> <br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> Refer to the documents below for detailed step-by-step guides to specific type of measurements.<br /> <br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> # '''Troubleshooting'''<br /> <br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.<br /> [[Category:SOP]]<br /> __FORCETOC__<br /> __INDEX__<br /> __NEWSECTIONLINK__</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=6 2026-03-23T22:39:47Z

<p>Vraj: Replaced content with &quot;=== &#039;&#039;&#039;SOP&#039;&#039;&#039; === * Keyence VK X3000&quot;</p> <hr /> <div>=== '''SOP''' ===<br /> <br /> * [[SOP Keyence VK X3000|Keyence VK X3000]]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=SOP_Keyence_VK_X3000&diff=5 2026-03-23T22:38:10Z

<p>Vraj: Add Raw DOCX data</p> <hr /> <div>'''Keyence VK-X3000 Confocal Microscope SOP# : OAS-PF-0410-00''' <br /> <br /> '''User Responsibility, Training, and Consequences of Misuse'''<br /> <br /> OASIS prototyping facility, Protofab, operates as a shared research and prototyping facility. All users are expected to follow this SOP, facility policies, and applicable safety guidelines to ensure safe operation, equipment longevity, and equitable access for all users.<br /> <br /> '''This SOP is not a substitute for hands-on training or tool qualification. Refer to User’s Manual and Guides for details.'''<br /> <br /> Users must complete required Protofab training and receive authorization prior to independent tool use. In the event of misuse, unintentional error, or non-compliance, corrective actions will be educational, proportional, and focused on preventing recurrence, taking into account the user’s experience level and the nature of the issue.<br /> <br /> Corrective actions may include:<br /> <br /> * Clarification or coaching on proper tool use<br /> * Additional training or temporary supervision<br /> * Temporary suspension of independent tool access<br /> * Restriction to supervised use until competency is re-established<br /> <br /> Users may be held responsible for repair, cleaning, or downtime costs only in cases of negligence or repeated misuse.<br /> <br /> # '''Purpose'''<br /> <br /> The Keyence Digital Microscope is used in Protofab to perform high-resolution optical inspection, dimensional measurement, surface characterization, and documentation of micro- and opto-electronic devices and components.<br /> <br /> The system supports process development, in-process verification, failure analysis, and final inspection across research, prototyping, and low-volume manufacturing activities.<br /> <br /> # '''Scope'''<br /> <br /> This SOP applies to all uses of the Keyence microscope for non-destructive inspection and metrology of parts, assemblies, and substrates processed within Protofab.<br /> <br /> The microscope is intended for room-temperature, dry inspection only and shall not be used for live electrical probing, destructive testing, or chemical exposure.<br /> <br /> == 2. Safety &amp; EHS ==<br /> <br /> * PPE such as protective eyewear is mandatory except while using microscope eyepieces. Refer to facility rules for details.<br /> <br /> * Do not stare at the LED light or reflected beam.<br /> * Do not touch the lens revolver while it is moving. Doing so risks catching hands or fingers in the mechanism.<br /> * Do not place your hand between the stage and the unit. Doing so may result in your hand getting caught and subsequent injury.<br /> <br /> == 3. Tool Application ==<br /> '''The Keyence microscope may be used for, but is not limited to:'''<br /> <br /> * Die attach inspection (epoxy, eutectic, or solder joints)<br /> * Wire bond inspection (ball, wedge, stitch, stud bumps)<br /> * Optical alignment verification (fiber attach, free-space optics)<br /> * Surface topography and defect inspection (scratches, voids, residues)<br /> * Dimensional measurements (feature size, pitch, height, coplanarity)<br /> * Documentation and image capture for reports, travelers, and failure analysis<br /> <br /> '''The following materials are permitted for inspection on the Keyence microscope:'''<br /> <br /> * Silicon, glass, quartz, and sapphire substrates<br /> * Ceramic submounts (AlN, Alumina, BeO*)<br /> * Metal leadframes and metallized substrates (Au, Cu, Ni, Pd, Al coatings)<br /> * Optical fibers, ferrules, lenses, and passive optical components<br /> * Packaged or partially assembled micro- and opto-electronic devices<br /> <br /> '''Restrictions:'''<br /> <br /> * No wet, liquid-bearing, or outgassing samples<br /> * No sample heavier than 6.6lbs (3kg)<br /> * No loose powders or particles that may contaminate optics or stages<br /> <br /> &lt;nowiki&gt;*&lt;/nowiki&gt;BeO substrates require prior OASIS approval and proper labeling.<br /> <br /> == 4. Pre-use checks (before every run) ==<br /> <br /> * Visual inspection the cleanliness of the stage from debris or contamination<br /> * Verify that stage was not locked for transportation. If so, unlock the stage as below: <br /> <br /> == 5. Standard operating procedure ==<br /> <br /> === 5.1 Startup ===<br /> 1. Turn on the main power switch<br /> <br /> 2. Turn on the power switch on measurement unit.<br /> <br /> 3. Turn on power of the control PC.<br /> <br /> === 5.2 Normal operation ===<br /> 1. Initializing Lens Position<br /> <br /> # Strat the Viewer Application<br /> # Turn the focusing handle (coarse/fine) to lower the XY stage to lowest level possible.<br /> <br /> # and initialize the lens position and motorized XY stage (return them to their origin). <br /> <br /> # Click [OK] in the confirmation message.<br /> <br /> # Load the sample: Place the sample on the rotating stage for observation/measurement.<br /> <br /> # Select the objective lens to be used with the Viewer Application. The revolver rotates and the objective lens changes.<br /> <br /> # Adjust the observation Position by clicking the mouse in the Viewer Application or clicking the mouse. Refer to Reference manual for details.<br /> <br /> # Adjust the focus by turning the handle (coarse/fine) or the Viewer Application. Refer to the manual for details.<br /> <br /> === 5.3 Shutdown ===<br /> 1. Shut down the PC after closing the applications.<br /> <br /> 2. Turn off the measurement unit.<br /> <br /> 3. Turn off the controller.<br /> <br /> # '''Metrology &amp; Observation Procedures'''<br /> <br /> Refer to below documents for general operation and features of the system.<br /> <br /> * “User’s Manual_VK-X3000” for Hardware<br /> * “Ref Manual Viewer Application” for operating software<br /> * “Ref Manual Multifile Analyzer Software_VK-X3000<br /> <br /> Refer to the documents below for detailed step-by-step guides to specific type of measurements.<br /> <br /> * “Profile Measurement” for virtual cross-section.<br /> * “Plane Measurement” for point height and exporting results.<br /> * “Surface Roughness Measurement” for line, multiline and surface roughness.<br /> * “Volume &amp; Area Measurement” for concave and convex volume, cross sectonal area and surface area.<br /> * “Gathering New Data using Laser Confocal” for setting used in confocal mode.<br /> * “Gathering New Film Thickness Data” such as permeable films and glass as well as transparent coatings.<br /> * “Process Image” to remove noise generated in the height data.<br /> * “Average Step Height Measurement (Flatness)” is a function to gather height difference, maximum height, minimum height, and flatness.<br /> * “Batch Analysis Recommendation” to efficiently conducting measurements across several similar samples.<br /> * “Comparative Measurement” allows direct comparison of 2 profiles from different samples.<br /> * “Teaching Module” is useful for evaluating multiple measurement positions by changing the lens to be used or measurement method. <br /> <br /> # '''Troubleshooting'''<br /> <br /> Do not attempt to fix any issue if you are not authorized. Contact facility personnel through portal and report the issue to be addresses.</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=4 2026-03-23T21:16:42Z

<p>Vraj: </p> <hr /> <div>&lt;strong&gt;Test Changes to the page MediaWiki has been installed.&lt;/strong&gt;<br /> <br /> Consult the [https://www.mediawiki.org/wiki/Special:MyLanguage/Help:Contents User's Guide] for information on using the wiki software.<br /> <br /> [[Test New page]]<br /> <br /> == Getting started ==<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:Configuration_settings Configuration settings list]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:FAQ MediaWiki FAQ]<br /> * [https://lists.wikimedia.org/postorius/lists/mediawiki-announce.lists.wikimedia.org/ MediaWiki release mailing list]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Localisation#Translation_resources Localise MediaWiki for your language]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:Combating_spam Learn how to combat spam on your wiki]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Main_Page&diff=3 2026-03-18T20:52:45Z

<p>Vraj: Test Page link live</p> <hr /> <div>&lt;strong&gt;MediaWiki has been installed.&lt;/strong&gt;<br /> <br /> Consult the [https://www.mediawiki.org/wiki/Special:MyLanguage/Help:Contents User's Guide] for information on using the wiki software.<br /> <br /> [[Test New page]]<br /> <br /> == Getting started ==<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:Configuration_settings Configuration settings list]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:FAQ MediaWiki FAQ]<br /> * [https://lists.wikimedia.org/postorius/lists/mediawiki-announce.lists.wikimedia.org/ MediaWiki release mailing list]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Localisation#Translation_resources Localise MediaWiki for your language]<br /> * [https://www.mediawiki.org/wiki/Special:MyLanguage/Manual:Combating_spam Learn how to combat spam on your wiki]</div>

Vraj https://protowiki.oasis.ucsb.edu/index.php?title=Test_New_page&diff=2 2026-03-18T20:52:25Z

<p>Vraj: Test Page live</p> <hr /> <div>Test Page</div>

Vraj